(kicad_pcb (version 20211014) (generator pcbnew)
  (general
    (thickness 1.6)
  )
  (paper "A")
  (title_block
    (title "Beetje 32U4 Blok")
    (date "2018-08-10")
    (rev "0.0")
    (company "www.MakersBox.us")
    (comment 1 "648.ken@gmail.com")
  )
  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
  )
  (setup
    (pad_to_mask_clearance 0)
    (pcbplotparams
      (layerselection 0x00010f0_ffffffff)
      (disableapertmacros false)
      (usegerberextensions true)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile false)
      (svguseinch false)
      (svgprecision 6)
      (excludeedgelayer true)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "gerbers/")
    )
  )
  (net 0 "")
  (net 1 "GND")
  (net 2 "Net-(C3-Pad1)")
  (net 3 "Net-(R10-Pad2)")
  (net 4 "Net-(R11-Pad2)")
  (net 5 "Net-(RP2-Pad1)")
  (net 6 "+3V3")
  (net 7 "unconnected-(U2-Pad7)")
  (net 8 "/Vm")
  (net 9 "unconnected-(SW1-Pad1)")
  (net 10 "Net-(F1-Pad2)")
  (net 11 "unconnected-(P2-Pad1)")
  (net 12 "Net-(RP1A1-Pad2)")
  (net 13 "Net-(D2-Pad1)")
  (net 14 "+5V")
  (net 15 "Net-(D11-Pad1)")
  (net 16 "Net-(D13-Pad1)")
  (net 17 "+BATT")
  (net 18 "Net-(R8-Pad1)")
  (net 19 "unconnected-(P4-Pad1)")
  (net 20 "unconnected-(U1-Pad4)")
  (net 21 "Net-(RP1A1-Pad1)")
  (footprint "footprints:M3mount" (layer "F.Cu")
    (tedit 636FC1C2)
    (at 167.64 131)
    (descr "Single banana socket, footprint - 6mm drill")
    (tags "banana socket")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "P4" (at 0 -3.3) (layer "F.SilkS") hide)
    (fp_text value "M3" (at 0.1 3.5) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" thru_hole circle locked (at 0 0) (size 5 5) (drill 3.4) (layers *.Cu *.Mask)
      (net 19 "unconnected-(P4-Pad1)") (pinfunction "Pin_1") (pintype "passive+no_connect"))
  )
  (footprint "footprints:C_0603" (layer "F.Cu")
    (tedit 59958EE7)
    (at 165 101.65)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "C10" (at 0 -1.5) (layer "F.Fab"))
    (fp_text value "1uF" (at -3 0.35) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd rect (at -0.75 0) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND") (pintype "passive"))
    (pad "2" smd rect (at 0.75 0) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 6 "+3V3") (pintype "passive"))
    (model "${KIPRJMOD}/3D/C_0603_1608Metric.step"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "footprints:SOT-23-5" (layer "F.Cu")
    (tedit 58CE4E7E)
    (at 165 98.5 -90)
    (descr "5-pin SOT23 package")
    (tags "SOT-23-5")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "U1" (at 0.15 -0.2 180) (layer "F.Fab"))
    (fp_text value "AP2127K" (at 0 2.5 90) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd rect locked (at -1.1 -0.95 270) (size 1.06 0.65) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 17 "+BATT") (pinfunction "VIN") (pintype "power_in"))
    (pad "2" smd rect locked (at -1.1 0 270) (size 1.06 0.65) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND") (pinfunction "GND") (pintype "power_in"))
    (pad "3" smd rect locked (at -1.1 0.95 270) (size 1.06 0.65) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 18 "Net-(R8-Pad1)") (pinfunction "EN") (pintype "input"))
    (pad "4" smd rect locked (at 1.1 0.95 270) (size 1.06 0.65) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 20 "unconnected-(U1-Pad4)") (pinfunction "NC") (pintype "no_connect"))
    (pad "5" smd rect locked (at 1.1 -0.95 270) (size 1.06 0.65) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 6 "+3V3") (pinfunction "VOUT") (pintype "power_out"))
    (model "${KISYS3DMOD}/TO_SOT_Packages_SMD.3dshapes/SOT-23-5.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "footprints:R_0603" (layer "F.Cu")
    (tedit 636FC042)
    (at 169 102.25 90)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "R9" (at 1.905 0 90) (layer "Dwgs.User"))
    (fp_text value "1K" (at -1.905 0 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd rect locked (at -0.75 0 90) (size 0.5 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 13 "Net-(D2-Pad1)") (pintype "passive"))
    (pad "2" smd rect locked (at 0.75 0 90) (size 0.5 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND") (pintype "passive"))
    (model "${KIPRJMOD}/3D/R_0603_1608Metric.step"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "footprints:TestPoint_Pad_D0.6mm" (layer "F.Cu")
    (tedit 5A0F774F)
    (at 162 116)
    (descr "SMD pad as test Point, diameter 1.0mm")
    (tags "test point SMD pad")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr exclude_from_pos_files)
    (fp_text reference "TP4" (at 0 -1.448) (layer "User.1") hide)
    (fp_text value "GND" (at 1 0) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 -1.45) (layer "F.Fab") hide)
    (pad "1" smd rect (at 0 0) (size 1.8 0.6) (layers "F.Cu" "F.Mask")
      (net 1 "GND") (pinfunction "1") (pintype "passive"))
  )
  (footprint "footprints:TestPoint_Pad_D0.6mm" (layer "F.Cu")
    (tedit 5A0F774F)
    (at 162 111.5)
    (descr "SMD pad as test Point, diameter 1.0mm")
    (tags "test point SMD pad")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr exclude_from_pos_files)
    (fp_text reference "TP5" (at 0 -1.448) (layer "User.1") hide)
    (fp_text value "BATT" (at 2 0) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 -1.45) (layer "F.Fab") hide)
    (pad "1" smd rect (at 0 0) (size 1.8 0.6) (layers "F.Cu" "F.Mask")
      (net 17 "+BATT") (pinfunction "1") (pintype "passive"))
  )
  (footprint "footprints:C_0805" (layer "F.Cu")
    (tedit 636FC0BD)
    (at 164 119)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "C2" (at 0 -1.5) (layer "F.Fab"))
    (fp_text value "10uF" (at -2 0.5 270) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 -1.5) (layer "F.Fab"))
    (pad "1" smd rect locked (at -1 0) (size 1 1.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "+5V") (pintype "passive"))
    (pad "2" smd rect locked (at 1 0) (size 1 1.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND") (pintype "passive"))
    (model "${KIPRJMOD}/3D/C_0805_2012Metric.step"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "footprints:R_0603" (layer "F.Cu")
    (tedit 636FC042)
    (at 162.75 125 180)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "RP1B1" (at 1.905 0) (layer "Dwgs.User"))
    (fp_text value "1K" (at -0.25 -1.5) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd rect locked (at -0.75 0 180) (size 0.5 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 12 "Net-(RP1A1-Pad2)") (pintype "passive"))
    (pad "2" smd rect locked (at 0.75 0 180) (size 0.5 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND") (pintype "passive"))
    (model "${KIPRJMOD}/3D/R_0603_1608Metric.step"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "footprints:LED_0603" (layer "F.Cu")
    (tedit 636FBDBF)
    (at 170.5 102.5 90)
    (descr "LED 0603 smd package")
    (tags "LED led 0603 SMD smd SMT smt smdled SMDLED smtled SMTLED")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "D2" (at 2.032 0 90) (layer "F.SilkS") hide)
    (fp_text value "3V3" (at 0 -3 90 unlocked) (layer "F.SilkS"))
    (pad "1" smd rect locked (at -0.8 0 270) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 13 "Net-(D2-Pad1)") (pinfunction "K") (pintype "passive"))
    (pad "2" smd rect locked (at 0.8 0 270) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 6 "+3V3") (pinfunction "A") (pintype "passive"))
    (model "${KIPRJMOD}/3D/LED_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "footprints:TestPoint_Pad_D0.6mm" (layer "F.Cu")
    (tedit 5A0F774F)
    (at 162 114.5)
    (descr "SMD pad as test Point, diameter 1.0mm")
    (tags "test point SMD pad")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr exclude_from_pos_files)
    (fp_text reference "TP3" (at 0 -1.448) (layer "User.1") hide)
    (fp_text value "Vm" (at 1 0) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 1.25 -1.95) (layer "F.Fab") hide)
    (pad "1" smd rect (at 0 0) (size 1.8 0.6) (layers "F.Cu" "F.Mask")
      (net 8 "/Vm") (pinfunction "1") (pintype "passive"))
  )
  (footprint "footprints:SW_EG1213" (layer "F.Cu")
    (tedit 69DFBBC1)
    (at 168.5 110.5 90)
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "SW1" (at -3.5 1.5 90) (layer "F.Fab"))
    (fp_text value "SW_SPDT" (at 0.05 -1.5 90) (layer "F.Fab"))
    (pad "1" thru_hole circle locked (at -2 0 90) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 9 "unconnected-(SW1-Pad1)") (pinfunction "A") (pintype "passive") (solder_mask_margin 0.102))
    (pad "2" thru_hole circle locked (at 0 0 90) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 10 "Net-(F1-Pad2)") (pinfunction "B") (pintype "passive") (solder_mask_margin 0.102))
    (pad "3" thru_hole circle locked (at 2 0 90) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask)
      (net 17 "+BATT") (pinfunction "C") (pintype "passive") (solder_mask_margin 0.102))
    (pad "P$4" thru_hole circle locked (at -4.85 0 90) (size 2.25 2.25) (drill 1.5) (layers *.Cu *.Mask)
      (solder_mask_margin 0.102))
    (pad "P$5" thru_hole circle locked (at 4.85 0 90) (size 2.25 2.25) (drill 1.5) (layers *.Cu *.Mask)
      (solder_mask_margin 0.102))
    (model "${KIPRJMOD}/footprints.pretty/SW_EG1213.step"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 90 180 -90))
    )
  )
  (footprint "footprints:R_0603" (layer "F.Cu")
    (tedit 636FC042)
    (at 169 95.75 90)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "R11" (at 1.905 0 90) (layer "Dwgs.User"))
    (fp_text value "1K" (at -1.905 0 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd rect locked (at -0.75 0 90) (size 0.5 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 15 "Net-(D11-Pad1)") (pintype "passive"))
    (pad "2" smd rect locked (at 0.75 0 90) (size 0.5 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "Net-(R11-Pad2)") (pintype "passive"))
    (model "${KIPRJMOD}/3D/R_0603_1608Metric.step"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "footprints:R_0603" (layer "F.Cu")
    (tedit 636FC042)
    (at 168.6 125 180)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "RP2" (at 1.905 0) (layer "Dwgs.User"))
    (fp_text value "10K" (at -0.25 -1.5) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd rect locked (at -0.75 0 180) (size 0.5 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 5 "Net-(RP2-Pad1)") (pintype "passive"))
    (pad "2" smd rect locked (at 0.75 0 180) (size 0.5 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND") (pintype "passive"))
    (model "${KIPRJMOD}/3D/R_0603_1608Metric.step"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "footprints:R_0603" (layer "F.Cu")
    (tedit 636FC042)
    (at 165.75 125 180)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "RP1A1" (at 1.905 0) (layer "Dwgs.User"))
    (fp_text value "1K" (at -0.25 -1.5) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd rect locked (at -0.75 0 180) (size 0.5 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 21 "Net-(RP1A1-Pad1)") (pintype "passive"))
    (pad "2" smd rect locked (at 0.75 0 180) (size 0.5 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 12 "Net-(RP1A1-Pad2)") (pintype "passive"))
    (model "${KIPRJMOD}/3D/R_0603_1608Metric.step"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "footprints:R_0603" (layer "F.Cu")
    (tedit 636FC042)
    (at 165.01 104)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "R8" (at 1.905 0) (layer "Dwgs.User"))
    (fp_text value "100K" (at -2.51 0) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd rect locked (at -0.75 0) (size 0.5 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 18 "Net-(R8-Pad1)") (pintype "passive"))
    (pad "2" smd rect locked (at 0.75 0) (size 0.5 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 17 "+BATT") (pintype "passive"))
    (model "${KIPRJMOD}/3D/R_0603_1608Metric.step"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "footprints:M3mount" (layer "F.Cu")
    (tedit 636FC1C2)
    (at 167.64 80.01)
    (descr "Single banana socket, footprint - 6mm drill")
    (tags "banana socket")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "P2" (at 0 -3.3) (layer "F.SilkS") hide)
    (fp_text value "M3" (at 0.1 3.5) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" thru_hole circle locked (at 0 0) (size 5 5) (drill 3.4) (layers *.Cu *.Mask)
      (net 11 "unconnected-(P2-Pad1)") (pinfunction "Pin_1") (pintype "passive+no_connect"))
  )
  (footprint "footprints:C_0603" (layer "F.Cu")
    (tedit 59958EE7)
    (at 165 95.1)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "C1" (at 0 -1.5) (layer "F.Fab"))
    (fp_text value "1uF" (at -2.5 -0.1) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd rect (at -0.75 0) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND") (pintype "passive"))
    (pad "2" smd rect (at 0.75 0) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 17 "+BATT") (pintype "passive"))
    (model "${KIPRJMOD}/3D/C_0603_1608Metric.step"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "footprints:MSOP-10_3x3mm_Pitch0.5mm" (layer "F.Cu")
    (tedit 5E84CEE1)
    (at 166 122)
    (descr "10-Lead Plastic Micro Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.5")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "U2" (at 0 0) (layer "F.Fab"))
    (fp_text value "MCP73833" (at 4.5 -1 90) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd rect locked (at -2.2 -1) (size 1.4 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "+5V") (pinfunction "VDD") (pintype "power_in"))
    (pad "2" smd rect locked (at -2.2 -0.5) (size 1.4 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "+5V") (pinfunction "VDD") (pintype "power_in"))
    (pad "3" smd rect locked (at -2.2 0) (size 1.4 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "Net-(R10-Pad2)") (pinfunction "STAT1") (pintype "output"))
    (pad "4" smd rect locked (at -2.2 0.5) (size 1.4 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "Net-(R11-Pad2)") (pinfunction "STAT2") (pintype "output"))
    (pad "5" smd rect locked (at -2.2 1) (size 1.4 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND") (pinfunction "VSS") (pintype "power_in"))
    (pad "6" smd rect locked (at 2.2 1) (size 1.4 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 21 "Net-(RP1A1-Pad1)") (pinfunction "PROG") (pintype "input"))
    (pad "7" smd rect locked (at 2.2 0.5) (size 1.4 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 7 "unconnected-(U2-Pad7)") (pinfunction "~{PG}(~{TE})") (pintype "output+no_connect"))
    (pad "8" smd rect locked (at 2.2 0) (size 1.4 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 5 "Net-(RP2-Pad1)") (pinfunction "THERM") (pintype "input"))
    (pad "9" smd rect locked (at 2.2 -0.5) (size 1.4 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "Net-(C3-Pad1)") (pinfunction "VBAT") (pintype "power_out"))
    (pad "10" smd rect locked (at 2.2 -1) (size 1.4 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "Net-(C3-Pad1)") (pinfunction "VBAT") (pintype "power_out"))
  )
  (footprint "footprints:TestPoint_Pad_D0.6mm" (layer "F.Cu")
    (tedit 5A0F774F)
    (at 162 113)
    (descr "SMD pad as test Point, diameter 1.0mm")
    (tags "test point SMD pad")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr exclude_from_pos_files)
    (fp_text reference "TP1" (at 0 -1.448) (layer "User.1") hide)
    (fp_text value "3V3" (at 1 0) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 1.25 -1.95) (layer "F.Fab") hide)
    (pad "1" smd rect (at 0 0) (size 1.8 0.6) (layers "F.Cu" "F.Mask")
      (net 6 "+3V3") (pinfunction "1") (pintype "passive"))
  )
  (footprint "footprints:TestPoint_Pad_D0.6mm" (layer "F.Cu")
    (tedit 5A0F774F)
    (at 162 117.5)
    (descr "SMD pad as test Point, diameter 1.0mm")
    (tags "test point SMD pad")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr exclude_from_pos_files)
    (fp_text reference "TP2" (at 0 -1.448) (layer "User.1") hide)
    (fp_text value "5V" (at 1.5 0) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 -1.45) (layer "F.Fab") hide)
    (pad "1" smd rect (at 0 0) (size 1.8 0.6) (layers "F.Cu" "F.Mask")
      (net 14 "+5V") (pinfunction "1") (pintype "passive"))
  )
  (footprint "footprints:R_0603" (layer "F.Cu")
    (tedit 636FC042)
    (at 164.99 108 180)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "RD2" (at 1.905 0) (layer "Dwgs.User"))
    (fp_text value "100K" (at 2.49 0) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd rect locked (at -0.75 0 180) (size 0.5 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 8 "/Vm") (pintype "passive"))
    (pad "2" smd rect locked (at 0.75 0 180) (size 0.5 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND") (pintype "passive"))
    (model "${KIPRJMOD}/3D/R_0603_1608Metric.step"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "footprints:LED_0603" (layer "F.Cu")
    (tedit 636FBDBF)
    (at 170.5 96 -90)
    (descr "LED 0603 smd package")
    (tags "LED led 0603 SMD smd SMT smt smdled SMDLED smtled SMTLED")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "D11" (at 2.032 0 90) (layer "F.SilkS") hide)
    (fp_text value "DONE" (at 0 3 90 unlocked) (layer "F.SilkS"))
    (pad "1" smd rect locked (at -0.8 0 90) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 15 "Net-(D11-Pad1)") (pinfunction "K") (pintype "passive"))
    (pad "2" smd rect locked (at 0.8 0 90) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "+5V") (pinfunction "A") (pintype "passive"))
    (model "${KIPRJMOD}/3D/LED_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "footprints:R_0603" (layer "F.Cu")
    (tedit 636FC042)
    (at 169 99 90)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "R10" (at 1.905 0 90) (layer "Dwgs.User"))
    (fp_text value "1K" (at -1.905 0 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd rect locked (at -0.75 0 90) (size 0.5 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 16 "Net-(D13-Pad1)") (pintype "passive"))
    (pad "2" smd rect locked (at 0.75 0 90) (size 0.5 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "Net-(R10-Pad2)") (pintype "passive"))
    (model "${KIPRJMOD}/3D/R_0603_1608Metric.step"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "footprints:C_0805" (layer "F.Cu")
    (tedit 636FC0BD)
    (at 168 119 180)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "C3" (at 0 -1.5) (layer "F.Fab"))
    (fp_text value "10uF" (at 1 1.5) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 -1.5) (layer "F.Fab"))
    (pad "1" smd rect locked (at -1 0 180) (size 1 1.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "Net-(C3-Pad1)") (pintype "passive"))
    (pad "2" smd rect locked (at 1 0 180) (size 1 1.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND") (pintype "passive"))
    (model "${KIPRJMOD}/3D/C_0805_2012Metric.step"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Fuse:Fuse_0805_2012Metric" (layer "F.Cu")
    (tedit 5F68FEF1)
    (at 164 110)
    (descr "Fuse SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "fuse")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "F1" (at 0 -1.65) (layer "F.Fab"))
    (fp_text value "F" (at -2.5 0) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -0.9375 0) (size 0.975 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "Net-(C3-Pad1)") (pintype "passive"))
    (pad "2" smd roundrect (at 0.9375 0) (size 0.975 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 10 "Net-(F1-Pad2)") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Fuse.3dshapes/Fuse_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "footprints:R_0603" (layer "F.Cu")
    (tedit 636FC042)
    (at 165.01 106 180)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "RD1" (at 1.905 0) (layer "Dwgs.User"))
    (fp_text value "100K" (at 2.51 0) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd rect locked (at -0.75 0 180) (size 0.5 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 17 "+BATT") (pintype "passive"))
    (pad "2" smd rect locked (at 0.75 0 180) (size 0.5 0.9) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 8 "/Vm") (pintype "passive"))
    (model "${KIPRJMOD}/3D/R_0603_1608Metric.step"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Connector_JST:JST_PH_S2B-PH-K_1x02_P2.00mm_Horizontal" (layer "F.Cu")
    (tedit 5B7745C6)
    (at 169.5 88.5 -90)
    (descr "JST PH series connector, S2B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator")
    (tags "connector JST PH top entry")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "J1" (at 1 2.45 -90) (layer "F.Fab"))
    (fp_text value "BAT" (at 5 -0.5) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 1 2.5 -90) (layer "F.Fab"))
    (pad "1" thru_hole roundrect (at 0 0 270) (size 1.2 1.75) (drill 0.75) (layers *.Cu *.Mask) (roundrect_rratio 0.208333)
      (net 2 "Net-(C3-Pad1)") (pinfunction "Pin_1") (pintype "passive"))
    (pad "2" thru_hole oval (at 2 0 270) (size 1.2 1.75) (drill 0.75) (layers *.Cu *.Mask)
      (net 1 "GND") (pinfunction "Pin_2") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Connector_JST.3dshapes/JST_PH_S2B-PH-K_1x02_P2.00mm_Horizontal.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "footprints:LED_0603" (layer "F.Cu")
    (tedit 636FBDBF)
    (at 170.5 99.2 90)
    (descr "LED 0603 smd package")
    (tags "LED led 0603 SMD smd SMT smt smdled SMDLED smtled SMTLED")
    (property "Sheetfile" "Board RPB30 SAM51 SeeSaw.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "D13" (at 2.032 0 90) (layer "F.SilkS") hide)
    (fp_text value "CHG" (at -0.3 -3 90 unlocked) (layer "F.SilkS"))
    (pad "1" smd rect locked (at -0.8 0 270) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 16 "Net-(D13-Pad1)") (pinfunction "K") (pintype "passive"))
    (pad "2" smd rect locked (at 0.8 0 270) (size 0.8 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "+5V") (pinfunction "A") (pintype "passive"))
    (model "${KIPRJMOD}/3D/LED_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_line (start 171.45 80.01) (end 171.45 123.19) (layer "Edge.Cuts") (width 0.15))
  (gr_line (start 171.45 123.19) (end 171.45 131.19) (layer "Edge.Cuts") (width 0.15))
  (gr_line (start 167.64 135) (end 163.694077 135) (layer "Edge.Cuts") (width 0.15))
  (gr_arc (start 160 80) (mid 161.115923 77.305923) (end 163.81 76.19) (layer "Edge.Cuts") (width 0.15))
  (gr_arc (start 171.45 131.19) (mid 170.334077 133.884077) (end 167.64 135) (layer "Edge.Cuts") (width 0.15))
  (gr_line (start 159.884077 131.19) (end 160 80) (layer "Edge.Cuts") (width 0.15))
  (gr_arc (start 163.694077 135) (mid 161 133.884077) (end 159.884077 131.19) (layer "Edge.Cuts") (width 0.15))
  (gr_arc (start 167.64 76.2) (mid 170.334077 77.315923) (end 171.45 80.01) (layer "Edge.Cuts") (width 0.15))
  (gr_line (start 163.81 76.19) (end 167.64 76.2) (layer "Edge.Cuts") (width 0.15))
  (gr_text "Rev 0.0\nApr 2025" (at 168 118 90) (layer "B.SilkS"))
  (gr_text "ON" (at 170.5 104.5) (layer "F.SilkS"))
  (gr_text "+ -" (at 171 89.5 270) (layer "F.SilkS"))
  (gr_text "OFF" (at 170 117) (layer "F.SilkS"))
  (dimension (type aligned) (layer "Dwgs.User")
    (pts (xy 134.6 85.4) (xy 134.6 82.6))
    (height 2.4)
    (gr_text "2.8000 mm" (at 135.85 84 90) (layer "Dwgs.User"))
    (format (units 2) (units_format 1) (precision 4))
    (style (thickness 0.15) (arrow_length 1.27) (text_position_mode 0) (extension_height 0.58642) (extension_offset 0) keep_text_aligned)
  )
  (dimension (type aligned) (layer "Dwgs.User")
    (pts (xy 110.49 135) (xy 110.49 76.2))
    (height -12.49)
    (gr_text "58.8000 mm" (at 96.85 105.6 90) (layer "Dwgs.User"))
    (format (units 2) (units_format 1) (precision 4))
    (style (thickness 0.15) (arrow_length 1.27) (text_position_mode 0) (extension_height 0.58642) (extension_offset 0) keep_text_aligned)
  )
  (dimension (type aligned) (layer "Dwgs.User")
    (pts (xy 171.45 131.19) (xy 106.68 131.19))
    (height -7.81)
    (gr_text "64.7700 mm" (at 139.065 137.85) (layer "Dwgs.User"))
    (format (units 2) (units_format 1) (precision 4))
    (style (thickness 0.15) (arrow_length 1.27) (text_position_mode 0) (extension_height 0.58642) (extension_offset 0) keep_text_aligned)
  )
)
