(kicad_pcb
	(version 20241229)
	(generator "pcbnew")
	(generator_version "9.0")
	(general
		(thickness 1.6)
		(legacy_teardrops no)
	)
	(paper "A4")
	(title_block
		(title "XBee Controller Board")
		(rev "A")
		(company "Fong Labs")
	)
	(layers
		(0 "F.Cu" signal)
		(2 "B.Cu" signal)
		(9 "F.Adhes" user "F.Adhesive")
		(11 "B.Adhes" user "B.Adhesive")
		(13 "F.Paste" user)
		(15 "B.Paste" user)
		(5 "F.SilkS" user "F.Silkscreen")
		(7 "B.SilkS" user "B.Silkscreen")
		(1 "F.Mask" user)
		(3 "B.Mask" user)
		(17 "Dwgs.User" user "User.Drawings")
		(19 "Cmts.User" user "User.Comments")
		(21 "Eco1.User" user "User.Eco1")
		(23 "Eco2.User" user "User.Eco2")
		(25 "Edge.Cuts" user)
		(27 "Margin" user)
		(31 "F.CrtYd" user "F.Courtyard")
		(29 "B.CrtYd" user "B.Courtyard")
		(35 "F.Fab" user)
		(33 "B.Fab" user)
		(39 "User.1" user)
		(41 "User.2" user)
		(43 "User.3" user)
		(45 "User.4" user)
		(47 "User.5" user)
		(49 "User.6" user)
		(51 "User.7" user)
		(53 "User.8" user)
		(55 "User.9" user)
	)
	(setup
		(stackup
			(layer "F.SilkS"
				(type "Top Silk Screen")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(thickness 0.01)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 1"
				(type "core")
				(thickness 1.51)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(thickness 0.01)
			)
			(layer "B.Paste"
				(type "Bottom Solder Paste")
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
			)
			(copper_finish "None")
			(dielectric_constraints no)
		)
		(pad_to_mask_clearance 0.0508)
		(allow_soldermask_bridges_in_footprints no)
		(tenting front back)
		(pcbplotparams
			(layerselection 0x00000000_00000000_55555555_5755f5ff)
			(plot_on_all_layers_selection 0x00000000_00000000_00000000_00000000)
			(disableapertmacros no)
			(usegerberextensions no)
			(usegerberattributes yes)
			(usegerberadvancedattributes yes)
			(creategerberjobfile yes)
			(dashed_line_dash_ratio 12.000000)
			(dashed_line_gap_ratio 3.000000)
			(svgprecision 4)
			(plotframeref no)
			(mode 1)
			(useauxorigin no)
			(hpglpennumber 1)
			(hpglpenspeed 20)
			(hpglpendiameter 15.000000)
			(pdf_front_fp_property_popups yes)
			(pdf_back_fp_property_popups yes)
			(pdf_metadata yes)
			(pdf_single_document no)
			(dxfpolygonmode yes)
			(dxfimperialunits yes)
			(dxfusepcbnewfont yes)
			(psnegative no)
			(psa4output no)
			(plot_black_and_white yes)
			(sketchpadsonfab no)
			(plotpadnumbers no)
			(hidednponfab no)
			(sketchdnponfab yes)
			(crossoutdnponfab yes)
			(subtractmaskfromsilk no)
			(outputformat 1)
			(mirror no)
			(drillshape 1)
			(scaleselection 1)
			(outputdirectory "")
		)
	)
	(net 0 "")
	(net 1 "+3.3V")
	(net 2 "+5V")
	(net 3 "Net-(U2-BYP)")
	(net 4 "Net-(D1-PadA)")
	(net 5 "Net-(D2-PadA)")
	(net 6 "Net-(D3-PadA)")
	(net 7 "/XBEE_OUT")
	(net 8 "/XBEE_IN")
	(net 9 "Net-(D4-PadA)")
	(net 10 "Net-(D5-PadA)")
	(net 11 "/XBEE_RSSI")
	(net 12 "/BUT1")
	(net 13 "/BUT2")
	(net 14 "/BUT3")
	(net 15 "/BUT4")
	(net 16 "/BUT5")
	(net 17 "/BUT7")
	(net 18 "/BUT6")
	(net 19 "/SCL")
	(net 20 "/SDA")
	(net 21 "/ANA6")
	(net 22 "/ANA5")
	(net 23 "/ANA4")
	(net 24 "/ANA3")
	(net 25 "/ANA7")
	(net 26 "/ANA1")
	(net 27 "/ANA8")
	(net 28 "GND")
	(net 29 "/ANA2")
	(net 30 "unconnected-(U3-DIO0-Pad20)")
	(net 31 "unconnected-(U3-DIO5-Pad15)")
	(net 32 "unconnected-(U3-DIO4-Pad11)")
	(net 33 "unconnected-(U3-DIO3-Pad17)")
	(net 34 "unconnected-(U3-DIO1-Pad19)")
	(net 35 "unconnected-(U3-RES@14-Pad14)")
	(net 36 "unconnected-(U3-DIO12-Pad4)")
	(net 37 "unconnected-(U3-RTS-Pad16)")
	(net 38 "unconnected-(U3-CTS-Pad12)")
	(net 39 "unconnected-(U3-DIO11-Pad7)")
	(net 40 "unconnected-(U3-DIO2-Pad18)")
	(net 41 "unconnected-(U3-RESET-Pad5)")
	(net 42 "unconnected-(U3-RES@8-Pad8)")
	(net 43 "unconnected-(U3-DIO9-Pad13)")
	(net 44 "unconnected-(U3-DTR-Pad9)")
	(net 45 "+3.3VADC")
	(net 46 "unconnected-(U1-VUSB-Pad34)")
	(net 47 "unconnected-(U1-32_OUT1B-Pad43)")
	(net 48 "unconnected-(U1-33_MCLK2-Pad44)")
	(net 49 "unconnected-(U1-9_OUT1C-Pad11)")
	(net 50 "unconnected-(U1-30_CRX3-Pad41)")
	(net 51 "unconnected-(U1-13_SCK_CRX1_LED-Pad20)")
	(net 52 "unconnected-(U1-12_MISO_MQSL-Pad14)")
	(net 53 "unconnected-(U1-GND-Pad17)")
	(net 54 "unconnected-(U1-PROGRAM-Pad18)")
	(net 55 "unconnected-(U1-31_CTX3-Pad42)")
	(net 56 "unconnected-(U1-28_RX7-Pad39)")
	(net 57 "unconnected-(U1-10_CS_MQSR-Pad12)")
	(net 58 "unconnected-(U1-26_A12_MOSI1-Pad37)")
	(net 59 "unconnected-(U1-VBAT-Pad15)")
	(net 60 "unconnected-(U1-29_TX7-Pad40)")
	(net 61 "unconnected-(U1-25_A11_RX6_SDA2-Pad36)")
	(net 62 "unconnected-(U1-3V3-Pad16)")
	(net 63 "unconnected-(U1-24_A10_TX6_SCL2-Pad35)")
	(net 64 "unconnected-(U1-11_MOSI_CTX1-Pad13)")
	(net 65 "unconnected-(U1-27_A13_SCK1-Pad38)")
	(net 66 "unconnected-(U1-ON_OFF-Pad19)")
	(footprint "transponder_server:R0603"
		(layer "F.Cu")
		(at 124.05 62)
		(descr "RESISTOR")
		(property "Reference" "R5"
			(at 1.65 0.6 0)
			(unlocked yes)
			(layer "F.SilkS")
		)
		(property "Value" "1k"
			(at -0.635 1.905 0)
			(unlocked yes)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "/")
		(sheetfile "transponder_server.kicad_sch")
		(pad "1" smd rect
			(at -0.85 0)
			(size 1 1.1)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 10 "Net-(D5-PadA)")
			(pinfunction "1")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "2" smd rect
			(at 0.85 0)
			(size 1 1.1)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 11 "/XBEE_RSSI")
			(pinfunction "2")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(embedded_fonts no)
	)
	(footprint "transponder_server:C1206"
		(layer "F.Cu")
		(at 157.9 81.5 180)
		(descr "CAPACITOR")
		(property "Reference" "C3"
			(at 0.9 -3 0)
			(unlocked yes)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "10uF"
			(at -1.27 2.54 180)
			(unlocked yes)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "/")
		(sheetfile "transponder_server.kicad_sch")
		(pad "1" smd rect
			(at -1.4 0 180)
			(size 1.6 1.8)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 1 "+3.3V")
			(pinfunction "1")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "2" smd rect
			(at 1.4 0 180)
			(size 1.6 1.8)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 28 "GND")
			(pinfunction "2")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(embedded_fonts no)
	)
	(footprint "transponder_server:JST-XH-03-PACKAGE-ROUND-PAD"
		(layer "F.Cu")
		(at 124 87.5 180)
		(descr "JST XH Connector Round Pads (Package)\n\nWire to board connector.  Pitch: 2,54 mm, (0.100\")\n\nNumber of pins: 3  Created by Rembrandt Electronics\n\nwww.rembrandtelectronics.com")
		(property "Reference" "X2"
			(at -5.555 2.04 270)
			(unlocked yes)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "JST-XH-03-PIN-ROUND-PAD"
			(at -4.6025 -3.8925 180)
			(unlocked yes)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "/")
		(sheetfile "transponder_server.kicad_sch")
		(fp_text user "1"
			(at -4.1675 1.4875 180)
			(unlocked yes)
			(layer "F.Fab")
		)
		(pad "1" thru_hole circle
			(at -2.54 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 45 "+3.3VADC")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "2" thru_hole circle
			(at 0 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 29 "/ANA2")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "3" thru_hole circle
			(at 2.54 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 28 "GND")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(embedded_fonts no)
	)
	(footprint "transponder_server:SCREWTERMINAL-3.5MM-2_LOCK"
		(layer "F.Cu")
		(at 161.3689 66.3222 90)
		(descr "Screw Terminal  3.5mm Pitch - 2 Pin PTH Locking Holes are offset from center 0.005\" to hold pins in place during soldering.\n\nSpecifications:\n\n• Pin count: 2\n• Pin pitch: 3.5mm/138mil\n\nDatasheet referenced for footprint\n\nExample device(s):\n\n• CONN_02")
		(property "Reference" "J1"
			(at -1.27 -4 90)
			(unlocked yes)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "CONN_023.5MM_LOCK"
			(at -1.27 -1.27 90)
			(unlocked yes)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "/")
		(sheetfile "transponder_server.kicad_sch")
		(pad "1" thru_hole rect
			(at -0.1778 0 90)
			(size 2.032 2.032)
			(drill 1.2)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 28 "GND")
			(pinfunction "1")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "2" thru_hole circle
			(at 3.6778 0 90)
			(size 2.032 2.032)
			(drill 1.2)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 2 "+5V")
			(pinfunction "2")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(embedded_fonts no)
	)
	(footprint "transponder_server:JST-XH-02-PACKAGE-ROUND-PAD"
		(layer "F.Cu")
		(at 160.5 128)
		(descr "JST XH Connector Round Pads (Package)\n\nWire to board connector.  Pitch: 2,54 mm, (0.100\")\n\nNumber of pins: 2  Created by Rembrandt Electronics\n\nwww.rembrandtelectronics.com")
		(property "Reference" "X9"
			(at -4.255 2.04 90)
			(unlocked yes)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "JST-XH-02-PIN-ROUND-PAD"
			(at -3.3025 -3.8925 0)
			(unlocked yes)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "/")
		(sheetfile "transponder_server.kicad_sch")
		(fp_text user "1"
			(at -2.8675 1.4875 0)
			(unlocked yes)
			(layer "F.Fab")
		)
		(pad "1" thru_hole circle
			(at -1.27 0 90)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 12 "/BUT1")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "2" thru_hole circle
			(at 1.27 0 90)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 28 "GND")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(embedded_fonts no)
	)
	(footprint "transponder_server:JST-XH-03-PACKAGE-ROUND-PAD"
		(layer "F.Cu")
		(at 123.96 120 180)
		(descr "JST XH Connector Round Pads (Package)\n\nWire to board connector.  Pitch: 2,54 mm, (0.100\")\n\nNumber of pins: 3  Created by Rembrandt Electronics\n\nwww.rembrandtelectronics.com")
		(property "Reference" "X7"
			(at -5.555 2.04 270)
			(unlocked yes)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "JST-XH-03-PIN-ROUND-PAD"
			(at -4.6025 -3.8925 180)
			(unlocked yes)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "/")
		(sheetfile "transponder_server.kicad_sch")
		(fp_text user "1"
			(at -4.1675 1.4875 180)
			(unlocked yes)
			(layer "F.Fab")
		)
		(pad "1" thru_hole circle
			(at -2.54 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 45 "+3.3VADC")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "2" thru_hole circle
			(at 0 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 25 "/ANA7")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "3" thru_hole circle
			(at 2.54 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 28 "GND")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(embedded_fonts no)
	)
	(footprint "transponder_server:JST-XH-03-PACKAGE-ROUND-PAD"
		(layer "F.Cu")
		(at 124 94 180)
		(descr "JST XH Connector Round Pads (Package)\n\nWire to board connector.  Pitch: 2,54 mm, (0.100\")\n\nNumber of pins: 3  Created by Rembrandt Electronics\n\nwww.rembrandtelectronics.com")
		(property "Reference" "X3"
			(at -5.555 2.04 270)
			(unlocked yes)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "JST-XH-03-PIN-ROUND-PAD"
			(at -4.6025 -3.8925 180)
			(unlocked yes)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "/")
		(sheetfile "transponder_server.kicad_sch")
		(fp_text user "1"
			(at -4.1675 1.4875 180)
			(unlocked yes)
			(layer "F.Fab")
		)
		(pad "1" thru_hole circle
			(at -2.54 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 45 "+3.3VADC")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "2" thru_hole circle
			(at 0 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 24 "/ANA3")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "3" thru_hole circle
			(at 2.54 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 28 "GND")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(embedded_fonts no)
	)
	(footprint ""
		(layer "F.Cu")
		(at 162.325 58.175)
		(property "Reference" "@HOLE3"
			(at 0 0 0)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" ""
			(at 0 0 0)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(pad "" np_thru_hole circle
			(at 0 0)
			(size 3.2 3.2)
			(drill 3.2)
			(layers "*.Cu" "*.Mask")
		)
		(embedded_fonts no)
	)
	(footprint "transponder_server:LED-0603"
		(layer "F.Cu")
		(at 119.977 74 180)
		(descr "LED 0603 SMT\n\n0603, surface mount.\n\nSpecifications:\n\n• Pin count: 2\n• Pin pitch:0.075inch\n• Area: 0.06\" x 0.03\"\n\nExample device(s):\n\n• LED - BLUE")
		(property "Reference" "D1"
			(at 0 -0.635 180)
			(unlocked yes)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "LED0603"
			(at 0 0.635 180)
			(unlocked yes)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "/")
		(sheetfile "transponder_server.kicad_sch")
		(pad "A" smd roundrect
			(at -0.877 0 90)
			(size 1 1)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(roundrect_rratio 0.15)
			(net 4 "Net-(D1-PadA)")
			(pinfunction "A")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "C" smd roundrect
			(at 0.877 0 90)
			(size 1 1)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(roundrect_rratio 0.15)
			(net 28 "GND")
			(pinfunction "C")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(embedded_fonts no)
	)
	(footprint "transponder_server:C0603"
		(layer "F.Cu")
		(at 162.85 81.5)
		(descr "CAPACITOR")
		(property "Reference" "C2"
			(at -1.35 2.5 0)
			(unlocked yes)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "0.01uF"
			(at -0.635 1.905 0)
			(unlocked yes)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "/")
		(sheetfile "transponder_server.kicad_sch")
		(pad "1" smd rect
			(at -0.85 0)
			(size 1.1 1)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 1 "+3.3V")
			(pinfunction "1")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "2" smd rect
			(at 0.85 0)
			(size 1.1 1)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 3 "Net-(U2-BYP)")
			(pinfunction "2")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(embedded_fonts no)
	)
	(footprint "transponder_server:JST-XH-04-PACKAGE-ROUND-PAD"
		(layer "F.Cu")
		(at 142.0989 91.7714 180)
		(descr "JST XH Connector Round Pads (Package)\n\nWire to board connector.  Pitch: 2,54 mm, (0.100\")\n\nNumber of pins: 4  Created by Rembrandt Electronics\n\nwww.rembrandtelectronics.com")
		(property "Reference" "X16"
			(at -6.655 2.04 270)
			(unlocked yes)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "JST-XH-04-PIN-ROUND-PAD"
			(at -6.0025 -3.8925 180)
			(unlocked yes)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "/")
		(sheetfile "transponder_server.kicad_sch")
		(fp_text user "1"
			(at -5.4675 1.4875 180)
			(unlocked yes)
			(layer "F.Fab")
		)
		(pad "1" thru_hole circle
			(at -3.81 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 2 "+5V")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "2" thru_hole circle
			(at -1.27 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 28 "GND")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "3" thru_hole circle
			(at 1.27 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 19 "/SCL")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "4" thru_hole circle
			(at 3.81 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 20 "/SDA")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(embedded_fonts no)
	)
	(footprint "transponder_server:JST-XH-03-PACKAGE-ROUND-PAD"
		(layer "F.Cu")
		(at 123.96 107 180)
		(descr "JST XH Connector Round Pads (Package)\n\nWire to board connector.  Pitch: 2,54 mm, (0.100\")\n\nNumber of pins: 3  Created by Rembrandt Electronics\n\nwww.rembrandtelectronics.com")
		(property "Reference" "X5"
			(at -5.44 2.04 270)
			(unlocked yes)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "JST-XH-03-PIN-ROUND-PAD"
			(at -4.6025 -3.8925 180)
			(unlocked yes)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "/")
		(sheetfile "transponder_server.kicad_sch")
		(fp_text user "1"
			(at -4.1675 1.4875 180)
			(unlocked yes)
			(layer "F.Fab")
		)
		(pad "1" thru_hole circle
			(at -2.54 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 45 "+3.3VADC")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "2" thru_hole circle
			(at 0 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 22 "/ANA5")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "3" thru_hole circle
			(at 2.54 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 28 "GND")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(embedded_fonts no)
	)
	(footprint "transponder_server:XBEE-SMD"
		(layer "F.Cu")
		(at 142.5 55.80595 180)
		(descr "Digi XBee and XBee-PRO RF Modules (SMD pads)\n\n20-pin 2mm SMD headers.\n\nhttps://www.sparkfun.com/datasheets/Wireless/Zigbee/XBee-Dimensional.pdf XBee Mechanical Drawings\n\nhttps://www.sparkfun.com/datasheets/Prototyping/Sockets/xbeeheadersmd2.pdf Header Mechanical Drawing\n\nhttps://www.sparkfun.com/products/10030 Header SparkFun Product Link")
		(property "Reference" "U3"
			(at -0.5 -28 180)
			(unlocked yes)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "XBEESMD"
			(at 7.1311 0.1586 180)
			(unlocked yes)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "/")
		(sheetfile "transponder_server.kicad_sch")
		(pad "1" smd rect
			(at -12.5 -20 270)
			(size 0.85 1.7)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 1 "+3.3V")
			(pinfunction "VDD")
			(pintype "power_in")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "2" smd rect
			(at -9.5 -18 270)
			(size 0.85 1.7)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 7 "/XBEE_OUT")
			(pinfunction "DOUT")
			(pintype "output")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "3" smd rect
			(at -12.5 -16 270)
			(size 0.85 1.7)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 8 "/XBEE_IN")
			(pinfunction "DIN")
			(pintype "input")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "4" smd rect
			(at -9.5 -14 270)
			(size 0.85 1.7)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 36 "unconnected-(U3-DIO12-Pad4)")
			(pinfunction "DIO12")
			(pintype "bidirectional")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "5" smd rect
			(at -12.5 -12 270)
			(size 0.85 1.7)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 41 "unconnected-(U3-RESET-Pad5)")
			(pinfunction "RESET")
			(pintype "input")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "6" smd rect
			(at -9.5 -10 270)
			(size 0.85 1.7)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 11 "/XBEE_RSSI")
			(pinfunction "RSSI")
			(pintype "bidirectional")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "7" smd rect
			(at -12.5 -8 270)
			(size 0.85 1.7)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 39 "unconnected-(U3-DIO11-Pad7)")
			(pinfunction "DIO11")
			(pintype "bidirectional")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "8" smd rect
			(at -9.5 -6 270)
			(size 0.85 1.7)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 42 "unconnected-(U3-RES@8-Pad8)")
			(pinfunction "RES@8")
			(pintype "bidirectional")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "9" smd rect
			(at -12.5 -4 270)
			(size 0.85 1.7)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 44 "unconnected-(U3-DTR-Pad9)")
			(pinfunction "DTR")
			(pintype "bidirectional")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "10" smd rect
			(at -9.5 -2 270)
			(size 0.85 1.7)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 28 "GND")
			(pinfunction "GND")
			(pintype "power_in")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "11" smd rect
			(at 12.5 -2 270)
			(size 0.85 1.7)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 32 "unconnected-(U3-DIO4-Pad11)")
			(pinfunction "DIO4")
			(pintype "bidirectional")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "12" smd rect
			(at 9.5 -4 270)
			(size 0.85 1.7)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 38 "unconnected-(U3-CTS-Pad12)")
			(pinfunction "CTS")
			(pintype "output")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "13" smd rect
			(at 12.5 -6 270)
			(size 0.85 1.7)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 43 "unconnected-(U3-DIO9-Pad13)")
			(pinfunction "DIO9")
			(pintype "bidirectional")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "14" smd rect
			(at 9.5 -8 270)
			(size 0.85 1.7)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 35 "unconnected-(U3-RES@14-Pad14)")
			(pinfunction "RES@14")
			(pintype "bidirectional")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "15" smd rect
			(at 12.5 -10 270)
			(size 0.85 1.7)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 31 "unconnected-(U3-DIO5-Pad15)")
			(pinfunction "DIO5")
			(pintype "bidirectional")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "16" smd rect
			(at 9.5 -12 270)
			(size 0.85 1.7)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 37 "unconnected-(U3-RTS-Pad16)")
			(pinfunction "RTS")
			(pintype "input")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "17" smd rect
			(at 12.5 -14 270)
			(size 0.85 1.7)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 33 "unconnected-(U3-DIO3-Pad17)")
			(pinfunction "DIO3")
			(pintype "bidirectional")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "18" smd rect
			(at 9.5 -16 270)
			(size 0.85 1.7)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 40 "unconnected-(U3-DIO2-Pad18)")
			(pinfunction "DIO2")
			(pintype "bidirectional")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "19" smd rect
			(at 12.5 -18 270)
			(size 0.85 1.7)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 34 "unconnected-(U3-DIO1-Pad19)")
			(pinfunction "DIO1")
			(pintype "bidirectional")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "20" smd rect
			(at 9.5 -20 270)
			(size 0.85 1.7)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 30 "unconnected-(U3-DIO0-Pad20)")
			(pinfunction "DIO0")
			(pintype "bidirectional")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(embedded_fonts no)
	)
	(footprint ""
		(layer "F.Cu")
		(at 162.325 134.375)
		(property "Reference" "@HOLE0"
			(at 0 0 0)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" ""
			(at 0 0 0)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(pad "" np_thru_hole circle
			(at 0 0)
			(size 3.2 3.2)
			(drill 3.2)
			(layers "*.Cu" "*.Mask")
		)
		(embedded_fonts no)
	)
	(footprint "transponder_server:R0603"
		(layer "F.Cu")
		(at 137.15 84.5 180)
		(descr "RESISTOR")
		(property "Reference" "R13"
			(at 5.15 -0.5 0)
			(unlocked yes)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "1k"
			(at -0.635 1.905 180)
			(unlocked yes)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "/")
		(sheetfile "transponder_server.kicad_sch")
		(pad "1" smd rect
			(at -0.85 0 180)
			(size 1 1.1)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 19 "/SCL")
			(pinfunction "1")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "2" smd rect
			(at 0.85 0 180)
			(size 1 1.1)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 1 "+3.3V")
			(pinfunction "2")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(embedded_fonts no)
	)
	(footprint "transponder_server:LED-0603"
		(layer "F.Cu")
		(at 120.077 68 180)
		(descr "LED 0603 SMT\n\n0603, surface mount.\n\nSpecifications:\n\n• Pin count: 2\n• Pin pitch:0.075inch\n• Area: 0.06\" x 0.03\"\n\nExample device(s):\n\n• LED - BLUE")
		(property "Reference" "D3"
			(at 0 -0.635 180)
			(unlocked yes)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "LED0603"
			(at 0 0.635 180)
			(unlocked yes)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "/")
		(sheetfile "transponder_server.kicad_sch")
		(pad "A" smd roundrect
			(at -0.877 0 90)
			(size 1 1)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(roundrect_rratio 0.15)
			(net 6 "Net-(D3-PadA)")
			(pinfunction "A")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "C" smd roundrect
			(at 0.877 0 90)
			(size 1 1)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(roundrect_rratio 0.15)
			(net 7 "/XBEE_OUT")
			(pinfunction "C")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(embedded_fonts no)
	)
	(footprint "transponder_server:JST-XH-03-PACKAGE-ROUND-PAD"
		(layer "F.Cu")
		(at 124 81 180)
		(descr "JST XH Connector Round Pads (Package)\n\nWire to board connector.  Pitch: 2,54 mm, (0.100\")\n\nNumber of pins: 3  Created by Rembrandt Electronics\n\nwww.rembrandtelectronics.com")
		(property "Reference" "X1"
			(at -5.555 2.04 270)
			(unlocked yes)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "JST-XH-03-PIN-ROUND-PAD"
			(at -4.6025 -3.8925 180)
			(unlocked yes)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "/")
		(sheetfile "transponder_server.kicad_sch")
		(fp_text user "1"
			(at -4.1675 1.4875 180)
			(unlocked yes)
			(layer "F.Fab")
		)
		(pad "1" thru_hole circle
			(at -2.54 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 45 "+3.3VADC")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "2" thru_hole circle
			(at 0 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 26 "/ANA1")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "3" thru_hole circle
			(at 2.54 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 28 "GND")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(embedded_fonts no)
	)
	(footprint "transponder_server:LED-0603"
		(layer "F.Cu")
		(at 120.077 65 180)
		(descr "LED 0603 SMT\n\n0603, surface mount.\n\nSpecifications:\n\n• Pin count: 2\n• Pin pitch:0.075inch\n• Area: 0.06\" x 0.03\"\n\nExample device(s):\n\n• LED - BLUE")
		(property "Reference" "D4"
			(at 0 -0.635 180)
			(unlocked yes)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "LED0603"
			(at 0 0.635 180)
			(unlocked yes)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "/")
		(sheetfile "transponder_server.kicad_sch")
		(pad "A" smd roundrect
			(at -0.877 0 90)
			(size 1 1)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(roundrect_rratio 0.15)
			(net 9 "Net-(D4-PadA)")
			(pinfunction "A")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "C" smd roundrect
			(at 0.877 0 90)
			(size 1 1)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(roundrect_rratio 0.15)
			(net 8 "/XBEE_IN")
			(pinfunction "C")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(embedded_fonts no)
	)
	(footprint "transponder_server:JST-XH-02-PACKAGE-ROUND-PAD"
		(layer "F.Cu")
		(at 160.5 95.5)
		(descr "JST XH Connector Round Pads (Package)\n\nWire to board connector.  Pitch: 2,54 mm, (0.100\")\n\nNumber of pins: 2  Created by Rembrandt Electronics\n\nwww.rembrandtelectronics.com")
		(property "Reference" "X14"
			(at -4.255 2.04 90)
			(unlocked yes)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "JST-XH-02-PIN-ROUND-PAD"
			(at -3.3025 -3.8925 0)
			(unlocked yes)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "/")
		(sheetfile "transponder_server.kicad_sch")
		(fp_text user "1"
			(at -2.8675 1.4875 0)
			(unlocked yes)
			(layer "F.Fab")
		)
		(pad "1" thru_hole circle
			(at -1.27 0 90)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 18 "/BUT6")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "2" thru_hole circle
			(at 1.27 0 90)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 28 "GND")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(embedded_fonts no)
	)
	(footprint "transponder_server:LED-0603"
		(layer "F.Cu")
		(at 120.223 62 180)
		(descr "LED 0603 SMT\n\n0603, surface mount.\n\nSpecifications:\n\n• Pin count: 2\n• Pin pitch:0.075inch\n• Area: 0.06\" x 0.03\"\n\nExample device(s):\n\n• LED - BLUE")
		(property "Reference" "D5"
			(at 0 -0.635 180)
			(unlocked yes)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "LED0603"
			(at 0 0.635 180)
			(unlocked yes)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "/")
		(sheetfile "transponder_server.kicad_sch")
		(pad "A" smd roundrect
			(at -0.877 0 90)
			(size 1 1)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(roundrect_rratio 0.15)
			(net 10 "Net-(D5-PadA)")
			(pinfunction "A")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "C" smd roundrect
			(at 0.877 0 90)
			(size 1 1)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(roundrect_rratio 0.15)
			(net 28 "GND")
			(pinfunction "C")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(embedded_fonts no)
	)
	(footprint "teensy.pretty-master:Teensy40"
		(layer "F.Cu")
		(at 142.88 117.15 90)
		(property "Reference" "U1"
			(at 0 -10.16 90)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "Teensy4.0"
			(at 0 10.16 90)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "/")
		(sheetfile "transponder_server.kicad_sch")
		(attr through_hole)
		(pad "1" thru_hole circle
			(at -16.51 7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 28 "GND")
			(pinfunction "GND")
			(pintype "power_in")
		)
		(pad "2" thru_hole circle
			(at -13.97 7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 7 "/XBEE_OUT")
			(pinfunction "0_RX1_CRX2_CS1")
			(pintype "bidirectional")
		)
		(pad "3" thru_hole circle
			(at -11.43 7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 8 "/XBEE_IN")
			(pinfunction "1_TX1_CTX2_MISO1")
			(pintype "bidirectional")
		)
		(pad "4" thru_hole circle
			(at -8.89 7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 12 "/BUT1")
			(pinfunction "2_OUT2")
			(pintype "bidirectional")
		)
		(pad "5" thru_hole circle
			(at -6.35 7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 13 "/BUT2")
			(pinfunction "3_LRCLK2")
			(pintype "bidirectional")
		)
		(pad "6" thru_hole circle
			(at -3.81 7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 14 "/BUT3")
			(pinfunction "4_BCLK2")
			(pintype "bidirectional")
		)
		(pad "7" thru_hole circle
			(at -1.27 7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 15 "/BUT4")
			(pinfunction "5_IN2")
			(pintype "bidirectional")
		)
		(pad "8" thru_hole circle
			(at 1.27 7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 16 "/BUT5")
			(pinfunction "6_OUT1D")
			(pintype "bidirectional")
		)
		(pad "9" thru_hole circle
			(at 3.81 7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 18 "/BUT6")
			(pinfunction "7_RX2_OUT1A")
			(pintype "bidirectional")
		)
		(pad "10" thru_hole circle
			(at 6.35 7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 17 "/BUT7")
			(pinfunction "8_TX2_IN1")
			(pintype "bidirectional")
		)
		(pad "11" thru_hole circle
			(at 8.89 7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 49 "unconnected-(U1-9_OUT1C-Pad11)")
			(pinfunction "9_OUT1C")
			(pintype "bidirectional")
		)
		(pad "12" thru_hole circle
			(at 11.43 7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 57 "unconnected-(U1-10_CS_MQSR-Pad12)")
			(pinfunction "10_CS_MQSR")
			(pintype "bidirectional")
		)
		(pad "13" thru_hole circle
			(at 13.97 7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 64 "unconnected-(U1-11_MOSI_CTX1-Pad13)")
			(pinfunction "11_MOSI_CTX1")
			(pintype "bidirectional")
		)
		(pad "14" thru_hole circle
			(at 16.51 7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 52 "unconnected-(U1-12_MISO_MQSL-Pad14)")
			(pinfunction "12_MISO_MQSL")
			(pintype "bidirectional")
		)
		(pad "15" thru_hole circle
			(at 16.51 5.08 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 59 "unconnected-(U1-VBAT-Pad15)")
			(pinfunction "VBAT")
			(pintype "power_in")
		)
		(pad "16" thru_hole circle
			(at 16.51 2.54 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 62 "unconnected-(U1-3V3-Pad16)")
			(pinfunction "3V3")
			(pintype "power_in")
		)
		(pad "17" thru_hole circle
			(at 16.51 0 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 53 "unconnected-(U1-GND-Pad17)")
			(pinfunction "GND")
			(pintype "power_in")
		)
		(pad "18" thru_hole circle
			(at 16.51 -2.54 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 54 "unconnected-(U1-PROGRAM-Pad18)")
			(pinfunction "PROGRAM")
			(pintype "input")
		)
		(pad "19" thru_hole circle
			(at 16.51 -5.08 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 66 "unconnected-(U1-ON_OFF-Pad19)")
			(pinfunction "ON_OFF")
			(pintype "input")
		)
		(pad "20" thru_hole circle
			(at 16.51 -7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 51 "unconnected-(U1-13_SCK_CRX1_LED-Pad20)")
			(pinfunction "13_SCK_CRX1_LED")
			(pintype "bidirectional")
		)
		(pad "21" thru_hole circle
			(at 13.97 -7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 26 "/ANA1")
			(pinfunction "14_A0_TX3_SPDIF_OUT")
			(pintype "bidirectional")
		)
		(pad "22" thru_hole circle
			(at 11.43 -7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 29 "/ANA2")
			(pinfunction "15_A1_RX3_SPDIF_IN")
			(pintype "bidirectional")
		)
		(pad "23" thru_hole circle
			(at 8.89 -7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 24 "/ANA3")
			(pinfunction "16_A2_RX4_SCL1")
			(pintype "bidirectional")
		)
		(pad "24" thru_hole circle
			(at 6.35 -7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 23 "/ANA4")
			(pinfunction "17_A3_TX4_SDA1")
			(pintype "bidirectional")
		)
		(pad "25" thru_hole circle
			(at 3.81 -7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 20 "/SDA")
			(pinfunction "18_A4_SDA0")
			(pintype "bidirectional")
		)
		(pad "26" thru_hole circle
			(at 1.27 -7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 19 "/SCL")
			(pinfunction "19_A5_SCL0")
			(pintype "bidirectional")
		)
		(pad "27" thru_hole circle
			(at -1.27 -7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 22 "/ANA5")
			(pinfunction "20_A6_TX5_LRCLK1")
			(pintype "bidirectional")
		)
		(pad "28" thru_hole circle
			(at -3.81 -7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 21 "/ANA6")
			(pinfunction "21_A7_RX5_BCLK1")
			(pintype "bidirectional")
		)
		(pad "29" thru_hole circle
			(at -6.35 -7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 25 "/ANA7")
			(pinfunction "22_A8_CTX1")
			(pintype "bidirectional")
		)
		(pad "30" thru_hole circle
			(at -8.89 -7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 27 "/ANA8")
			(pinfunction "23_A9_CRX1_MCLK1")
			(pintype "bidirectional")
		)
		(pad "31" thru_hole circle
			(at -11.43 -7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 45 "+3.3VADC")
			(pinfunction "3V3")
			(pintype "power_out")
		)
		(pad "32" thru_hole circle
			(at -13.97 -7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 28 "GND")
			(pinfunction "GND")
			(pintype "power_in")
		)
		(pad "33" thru_hole circle
			(at -16.51 -7.62 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 2 "+5V")
			(pinfunction "VIN")
			(pintype "power_in")
		)
		(pad "34" thru_hole circle
			(at -13.97 -5.08 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 46 "unconnected-(U1-VUSB-Pad34)")
			(pinfunction "VUSB")
			(pintype "power_out")
		)
		(pad "35" thru_hole circle
			(at 11.43 -5.08 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 63 "unconnected-(U1-24_A10_TX6_SCL2-Pad35)")
			(pinfunction "24_A10_TX6_SCL2")
			(pintype "bidirectional")
		)
		(pad "36" thru_hole circle
			(at 8.89 -5.08 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 61 "unconnected-(U1-25_A11_RX6_SDA2-Pad36)")
			(pinfunction "25_A11_RX6_SDA2")
			(pintype "bidirectional")
		)
		(pad "37" thru_hole circle
			(at 11.43 -2.54 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 58 "unconnected-(U1-26_A12_MOSI1-Pad37)")
			(pinfunction "26_A12_MOSI1")
			(pintype "bidirectional")
		)
		(pad "38" thru_hole circle
			(at 8.89 -2.54 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 65 "unconnected-(U1-27_A13_SCK1-Pad38)")
			(pinfunction "27_A13_SCK1")
			(pintype "bidirectional")
		)
		(pad "39" thru_hole circle
			(at 11.43 0 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 56 "unconnected-(U1-28_RX7-Pad39)")
			(pinfunction "28_RX7")
			(pintype "bidirectional")
		)
		(pad "40" thru_hole circle
			(at 8.89 0 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 60 "unconnected-(U1-29_TX7-Pad40)")
			(pinfunction "29_TX7")
			(pintype "bidirectional")
		)
		(pad "41" thru_hole circle
			(at 11.43 2.54 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 50 "unconnected-(U1-30_CRX3-Pad41)")
			(pinfunction "30_CRX3")
			(pintype "bidirectional")
		)
		(pad "42" thru_hole circle
			(at 8.89 2.54 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 55 "unconnected-(U1-31_CTX3-Pad42)")
			(pinfunction "31_CTX3")
			(pintype "bidirectional")
		)
		(pad "43" thru_hole circle
			(at 11.43 5.08 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 47 "unconnected-(U1-32_OUT1B-Pad43)")
			(pinfunction "32_OUT1B")
			(pintype "bidirectional")
		)
		(pad "44" thru_hole circle
			(at 8.89 5.08 90)
			(size 1.6 1.6)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 48 "unconnected-(U1-33_MCLK2-Pad44)")
			(pinfunction "33_MCLK2")
			(pintype "bidirectional")
		)
		(embedded_fonts no)
		(model "${KICAD_USER_DIR}/teensy.pretty/Teensy_4.0_Assembly.STEP"
			(offset
				(xyz 33 9.5 -11)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz -90 0 0)
			)
		)
	)
	(footprint "transponder_server:JST-XH-03-PACKAGE-ROUND-PAD"
		(layer "F.Cu")
		(at 124 126.5 180)
		(descr "JST XH Connector Round Pads (Package)\n\nWire to board connector.  Pitch: 2,54 mm, (0.100\")\n\nNumber of pins: 3  Created by Rembrandt Electronics\n\nwww.rembrandtelectronics.com")
		(property "Reference" "X8"
			(at -5.555 2.04 270)
			(unlocked yes)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "JST-XH-03-PIN-ROUND-PAD"
			(at -4.6025 -3.8925 180)
			(unlocked yes)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
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		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
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		(sheetname "/")
		(sheetfile "transponder_server.kicad_sch")
		(fp_text user "1"
			(at -4.1675 1.4875 180)
			(unlocked yes)
			(layer "F.Fab")
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		(pad "1" thru_hole circle
			(at -2.54 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 45 "+3.3VADC")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "2" thru_hole circle
			(at 0 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 27 "/ANA8")
			(pinfunction "S")
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			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "3" thru_hole circle
			(at 2.54 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 28 "GND")
			(pinfunction "S")
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			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(embedded_fonts no)
	)
	(footprint "transponder_server:R0603"
		(layer "F.Cu")
		(at 137.15 87.5 180)
		(descr "RESISTOR")
		(property "Reference" "R14"
			(at 5.0189 -0.7286 0)
			(unlocked yes)
			(layer "F.SilkS")
			(hide yes)
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		(property "Value" "1k"
			(at -0.635 1.905 180)
			(unlocked yes)
			(layer "F.Fab")
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		(property "Datasheet" ""
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			(layer "F.Fab")
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		(property "Description" ""
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			(layer "F.Fab")
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		(sheetname "/")
		(sheetfile "transponder_server.kicad_sch")
		(pad "1" smd rect
			(at -0.85 0 180)
			(size 1 1.1)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 20 "/SDA")
			(pinfunction "1")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
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		(pad "2" smd rect
			(at 0.85 0 180)
			(size 1 1.1)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 1 "+3.3V")
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			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(embedded_fonts no)
	)
	(footprint "transponder_server:JST-XH-02-PACKAGE-ROUND-PAD"
		(layer "F.Cu")
		(at 160.5 102)
		(descr "JST XH Connector Round Pads (Package)\n\nWire to board connector.  Pitch: 2,54 mm, (0.100\")\n\nNumber of pins: 2  Created by Rembrandt Electronics\n\nwww.rembrandtelectronics.com")
		(property "Reference" "X13"
			(at -4.255 2.04 90)
			(unlocked yes)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "JST-XH-02-PIN-ROUND-PAD"
			(at -3.3025 -3.8925 0)
			(unlocked yes)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
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			(layer "F.Fab")
			(hide yes)
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		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
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		(sheetname "/")
		(sheetfile "transponder_server.kicad_sch")
		(fp_text user "1"
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			(unlocked yes)
			(layer "F.Fab")
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		(pad "1" thru_hole circle
			(at -1.27 0 90)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 16 "/BUT5")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "2" thru_hole circle
			(at 1.27 0 90)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 28 "GND")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(embedded_fonts no)
	)
	(footprint "transponder_server:JST-XH-03-PACKAGE-ROUND-PAD"
		(layer "F.Cu")
		(at 123.96 113.5 180)
		(descr "JST XH Connector Round Pads (Package)\n\nWire to board connector.  Pitch: 2,54 mm, (0.100\")\n\nNumber of pins: 3  Created by Rembrandt Electronics\n\nwww.rembrandtelectronics.com")
		(property "Reference" "X6"
			(at -5.555 2.04 270)
			(unlocked yes)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "JST-XH-03-PIN-ROUND-PAD"
			(at -4.6025 -3.8925 180)
			(unlocked yes)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
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		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "/")
		(sheetfile "transponder_server.kicad_sch")
		(fp_text user "1"
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			(unlocked yes)
			(layer "F.Fab")
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		(pad "1" thru_hole circle
			(at -2.54 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 45 "+3.3VADC")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "2" thru_hole circle
			(at 0 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 21 "/ANA6")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "3" thru_hole circle
			(at 2.54 0 270)
			(size 1.524 1.524)
			(drill 1.016)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 28 "GND")
			(pinfunction "S")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(embedded_fonts no)
	)
	(footprint "transponder_server:LED-0603"
		(layer "F.Cu")
		(at 120.023 71 180)
		(descr "LED 0603 SMT\n\n0603, surface mount.\n\nSpecifications:\n\n• Pin count: 2\n• Pin pitch:0.075inch\n• Area: 0.06\" x 0.03\"\n\nExample device(s):\n\n• LED - BLUE")
		(property "Reference" "D2"
			(at 0 -0.635 180)
			(unlocked yes)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "LED0603"
			(at 0 0.635 180)
			(unlocked yes)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
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		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
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		(sheetname "/")
		(sheetfile "transponder_server.kicad_sch")
		(pad "A" smd roundrect
			(at -0.877 0 90)
			(size 1 1)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(roundrect_rratio 0.15)
			(net 5 "Net-(D2-PadA)")
			(pinfunction "A")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(pad "C" smd roundrect
			(at 0.877 0 90)
			(size 1 1)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(roundrect_rratio 0.15)
			(net 28 "GND")
			(pinfunction "C")
			(pintype "passive")
			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
		)
		(embedded_fonts no)
	)
	(footprint "transponder_server:C0603"
		(layer "F.Cu")
		(at 158.15 70 180)
		(descr "CAPACITOR")
		(property "Reference" "C1"
			(at -3.95 0.8 180)
			(unlocked yes)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "1uF"
			(at -0.635 1.905 180)
			(unlocked yes)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
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		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
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		(sheetname "/")
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		(pad "1" smd rect
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			(size 1.1 1)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 2 "+5V")
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			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
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		(pad "2" smd rect
			(at 0.85 0 180)
			(size 1.1 1)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 28 "GND")
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			(solder_mask_margin 0.0635)
			(thermal_bridge_angle 0)
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		(embedded_fonts no)
	)
	(footprint "transponder_server:R0603"
		(layer "F.Cu")
		(at 123.95 74)
		(descr "RESISTOR")
		(property "Reference" "R1"
			(at 1.65 0.5 0)
			(unlocked yes)
			(layer "F.SilkS")
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		(property "Value" "1k"
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		(pad "1" smd rect
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			(layers "F.Cu" "F.Mask" "F.Paste")
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			(solder_mask_margin 0.0635)
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		(pad "2" smd rect
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			(size 1 1.1)
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		(embedded_fonts no)
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	(footprint "transponder_server:JST-XH-02-PACKAGE-ROUND-PAD"
		(layer "F.Cu")
		(at 160.5 108.5)
		(descr "JST XH Connector Round Pads (Package)\n\nWire to board connector.  Pitch: 2,54 mm, (0.100\")\n\nNumber of pins: 2  Created by Rembrandt Electronics\n\nwww.rembrandtelectronics.com")
		(property "Reference" "X12"
			(at -4.255 2.04 90)
			(unlocked yes)
			(layer "F.SilkS")
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		(property "Value" "JST-XH-02-PIN-ROUND-PAD"
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			(unlocked yes)
			(layer "F.Fab")
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		(property "Datasheet" ""
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		(property "Description" ""
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			(layer "F.Fab")
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		(sheetname "/")
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			(size 1.524 1.524)
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			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 15 "/BUT4")
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		(pad "2" thru_hole circle
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			(size 1.524 1.524)
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			(layers "*.Cu" "*.Mask")
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		(embedded_fonts no)
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	(footprint ""
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		(property "Reference" "@HOLE1"
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		(property "Value" ""
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	(footprint "transponder_server:JST-XH-03-PACKAGE-ROUND-PAD"
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		(descr "JST XH Connector Round Pads (Package)\n\nWire to board connector.  Pitch: 2,54 mm, (0.100\")\n\nNumber of pins: 3  Created by Rembrandt Electronics\n\nwww.rembrandtelectronics.com")
		(property "Reference" "X4"
			(at -5.555 2.04 270)
			(unlocked yes)
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			(layers "F.Cu" "F.Mask" "F.Paste")
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			(size 0.6 2.2)
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			(layers "F.Cu" "F.Mask" "F.Paste")
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