(kicad_pcb
	(version 20241229)
	(generator "pcbnew")
	(generator_version "9.0")
	(general
		(thickness 0.8836)
		(legacy_teardrops no)
	)
	(paper "A4")
	(layers
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		(2 "B.Cu" signal)
		(9 "F.Adhes" user "F.Adhesive")
		(11 "B.Adhes" user "B.Adhesive")
		(13 "F.Paste" user)
		(15 "B.Paste" user)
		(5 "F.SilkS" user "F.Silkscreen")
		(7 "B.SilkS" user "B.Silkscreen")
		(1 "F.Mask" user)
		(3 "B.Mask" user)
		(17 "Dwgs.User" user "User.Drawings")
		(19 "Cmts.User" user "User.Comments")
		(21 "Eco1.User" user "User.Eco1")
		(23 "Eco2.User" user "User.Eco2")
		(25 "Edge.Cuts" user)
		(27 "Margin" user)
		(31 "F.CrtYd" user "F.Courtyard")
		(29 "B.CrtYd" user "B.Courtyard")
		(35 "F.Fab" user)
		(33 "B.Fab" user)
	)
	(setup
		(stackup
			(layer "F.SilkS"
				(type "Top Silk Screen")
				(color "White")
				(material "Direct Printing")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(color "Purple")
				(thickness 0.0152)
				(material "Dry Film")
				(epsilon_r 3.3)
				(loss_tangent 0)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.0711)
			)
			(layer "dielectric 1"
				(type "core")
				(color "FR4 natural")
				(thickness 0.711)
				(material "FR4")
				(epsilon_r 4.27)
				(loss_tangent 0.016)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.0711)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(color "Purple")
				(thickness 0.0152)
				(material "Dry Film")
				(epsilon_r 3.3)
				(loss_tangent 0)
			)
			(layer "B.Paste"
				(type "Bottom Solder Paste")
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
				(color "White")
				(material "Direct Printing")
			)
			(copper_finish "ENIG")
			(dielectric_constraints no)
		)
		(pad_to_mask_clearance 0.0508)
		(allow_soldermask_bridges_in_footprints no)
		(tenting front back)
		(aux_axis_origin 123.15 99.160995)
		(grid_origin 123.15 99.160995)
		(pcbplotparams
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			(plot_on_all_layers_selection 0x00000000_00000000_00000000_00000000)
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			(usegerberextensions no)
			(usegerberattributes yes)
			(usegerberadvancedattributes yes)
			(creategerberjobfile yes)
			(dashed_line_dash_ratio 12.000000)
			(dashed_line_gap_ratio 3.000000)
			(svgprecision 4)
			(plotframeref no)
			(mode 1)
			(useauxorigin no)
			(hpglpennumber 1)
			(hpglpenspeed 20)
			(hpglpendiameter 15.000000)
			(pdf_front_fp_property_popups yes)
			(pdf_back_fp_property_popups yes)
			(pdf_metadata yes)
			(pdf_single_document no)
			(dxfpolygonmode yes)
			(dxfimperialunits yes)
			(dxfusepcbnewfont yes)
			(psnegative no)
			(psa4output no)
			(plot_black_and_white yes)
			(sketchpadsonfab no)
			(plotpadnumbers no)
			(hidednponfab no)
			(sketchdnponfab no)
			(crossoutdnponfab no)
			(subtractmaskfromsilk no)
			(outputformat 1)
			(mirror no)
			(drillshape 0)
			(scaleselection 1)
			(outputdirectory "./")
		)
	)
	(net 0 "")
	(net 1 "SS")
	(net 2 "mosi")
	(net 3 "mso")
	(net 4 "sck")
	(net 5 "vcc")
	(net 6 "gnd")
	(footprint "Connector_PinHeader_2.54mm:PinHeader_1x06_P2.54mm_Vertical"
		(layer "F.Cu")
		(at 130.65 83.160995)
		(descr "Through hole straight pin header, 1x06, 2.54mm pitch, single row")
		(tags "Through hole pin header THT 1x06 2.54mm single row")
		(property "Reference" "J1"
			(at -0.649603 -2.145104 0)
			(layer "F.SilkS")
		)
		(property "Value" "PinHeader_1x06_P2.54mm_Vertical"
			(at 0 15.08 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(attr through_hole)
		(fp_text user "${REFERENCE}"
			(at 0 6.35 90)
			(layer "F.Fab")
		)
		(pad "1" thru_hole rect
			(at 0 0)
			(size 1.7 1.7)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 6 "gnd")
		)
		(pad "2" thru_hole circle
			(at 0 2.54)
			(size 1.7 1.7)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 5 "vcc")
		)
		(pad "3" thru_hole circle
			(at 0 5.08)
			(size 1.7 1.7)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 1 "SS")
		)
		(pad "4" thru_hole circle
			(at 0 7.62)
			(size 1.7 1.7)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 2 "mosi")
		)
		(pad "5" thru_hole circle
			(at 0 10.16)
			(size 1.7 1.7)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 3 "mso")
		)
		(pad "6" thru_hole circle
			(at 0 12.7)
			(size 1.7 1.7)
			(drill 1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 4 "sck")
		)
		(embedded_fonts no)
		(model "${KICAD9_3DMODEL_DIR}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x06_P2.54mm_Vertical.step"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(gr_line
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	)
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		(layer "Edge.Cuts")
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	(gr_arc
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		(layer "Edge.Cuts")
	)
	(gr_text "GND\nVCC\nSS\nMOSI\nMISO\nSCK"
		(at 128.65 96.966476 0)
		(layer "F.SilkS")
	)
	(gr_text "Board Thickness: "
		(at 226.714281 29.654995 0)
		(layer "Cmts.User")
	)
	(gr_text ""
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		(layer "Cmts.User")
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	(gr_text ""
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	(gr_text "No"
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	(gr_text "No"
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		(layer "Cmts.User")
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	(gr_text "No"
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		(layer "Cmts.User")
	)
	(gr_text "Copper Finish: "
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		(layer "Cmts.User")
	)
	(gr_text "23.7000 mm x 20.0000 mm"
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		(layer "Cmts.User")
	)
	(gr_text "Min track/spacing: "
		(at 159.9 37.568995 0)
		(layer "Cmts.User")
	)
	(gr_text "Castellated pads: "
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	(gr_text "2"
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		(layer "Cmts.User")
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	(gr_text "Edge card connectors: "
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	(gr_text "0.0000 mm / 0.0000 mm"
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	(gr_text "0.3000 mm"
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		(layer "Cmts.User")
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	(gr_text "BOARD CHARACTERISTICS"
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	(gr_text "0.8836 mm"
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	(zone
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		(layer "F.Cu")
		(name "$teardrop_padvia$")
		(hatch none 0.1)
		(priority 30001)
		(attr
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				(type padvia)
			)
		)
		(connect_pads yes
			(clearance 0)
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		(min_thickness 0.0254)
		(filled_areas_thickness no)
		(fill yes
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			(thermal_bridge_width 0.5)
			(island_removal_mode 1)
			(island_area_min 10)
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		(polygon
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				(xy 136.317412 92.277772)
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