(kicad_pcb
	(version 20241229)
	(generator "pcbnew")
	(generator_version "9.0")
	(general
		(thickness 1.6256)
		(legacy_teardrops no)
	)
	(paper "A3")
	(layers
		(0 "F.Cu" signal "SIG1")
		(2 "B.Cu" signal "SIG2")
		(9 "F.Adhes" user "F.Adhesive")
		(11 "B.Adhes" user "B.Adhesive")
		(13 "F.Paste" user)
		(15 "B.Paste" user)
		(5 "F.SilkS" user "F.Silkscreen")
		(7 "B.SilkS" user "B.Silkscreen")
		(1 "F.Mask" user)
		(3 "B.Mask" user)
		(17 "Dwgs.User" user "User.Drawings")
		(19 "Cmts.User" user "User.Comments")
		(21 "Eco1.User" user "User.Eco1")
		(23 "Eco2.User" user "User.Eco2")
		(25 "Edge.Cuts" user)
		(27 "Margin" user)
		(31 "F.CrtYd" user "F.Courtyard")
		(29 "B.CrtYd" user "B.Courtyard")
		(35 "F.Fab" user)
		(33 "B.Fab" user)
		(39 "User.1" user)
		(41 "User.2" user)
		(43 "User.3" user)
		(45 "User.4" user)
	)
	(setup
		(stackup
			(layer "F.SilkS"
				(type "Top Silk Screen")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(thickness 0.01524)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.03556)
			)
			(layer "dielectric 1"
				(type "core")
				(thickness 1.524)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.03556)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(thickness 0.01524)
			)
			(layer "B.Paste"
				(type "Bottom Solder Paste")
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
			)
			(copper_finish "None")
			(dielectric_constraints no)
		)
		(pad_to_mask_clearance 0.0635)
		(solder_mask_min_width 0.0762)
		(allow_soldermask_bridges_in_footprints no)
		(tenting front back)
		(pcbplotparams
			(layerselection 0x00000000_00000000_55555555_5755f5ff)
			(plot_on_all_layers_selection 0x00000000_00000000_00000000_00000000)
			(disableapertmacros no)
			(usegerberextensions no)
			(usegerberattributes yes)
			(usegerberadvancedattributes yes)
			(creategerberjobfile yes)
			(dashed_line_dash_ratio 12.000000)
			(dashed_line_gap_ratio 3.000000)
			(svgprecision 4)
			(plotframeref no)
			(mode 1)
			(useauxorigin no)
			(hpglpennumber 1)
			(hpglpenspeed 20)
			(hpglpendiameter 15.000000)
			(pdf_front_fp_property_popups yes)
			(pdf_back_fp_property_popups yes)
			(pdf_metadata yes)
			(pdf_single_document no)
			(dxfpolygonmode yes)
			(dxfimperialunits yes)
			(dxfusepcbnewfont yes)
			(psnegative no)
			(psa4output no)
			(plot_black_and_white yes)
			(sketchpadsonfab no)
			(plotpadnumbers no)
			(hidednponfab no)
			(sketchdnponfab yes)
			(crossoutdnponfab yes)
			(subtractmaskfromsilk no)
			(outputformat 1)
			(mirror no)
			(drillshape 1)
			(scaleselection 1)
			(outputdirectory "")
		)
	)
	(net 0 "")
	(net 1 "GND")
	(net 2 "/chip_supply/BG Reference Tunable Load 1/vin")
	(net 3 "/NONOV1")
	(net 4 "/SEL0")
	(net 5 "/AVDD")
	(net 6 "Net-(C6-Pad1)")
	(net 7 "/VOUT_N")
	(net 8 "/NONOV0")
	(net 9 "/NONOV_EN")
	(net 10 "/CHIP_ID")
	(net 11 "/VREF2")
	(net 12 "/SEL1")
	(net 13 "/VOUT_P")
	(net 14 "/PWM_EN")
	(net 15 "/IBIAS")
	(net 16 "/VIN")
	(net 17 "/VREF1")
	(net 18 "/PWM_P")
	(net 19 "/PWM_N")
	(net 20 "unconnected-(BGREF1-IC-Pad8)")
	(net 21 "Net-(BGREF1-NR)")
	(net 22 "unconnected-(BGREF1-IC-Pad5)")
	(net 23 "+5V")
	(net 24 "Net-(POT1-Pad1)")
	(net 25 "/FGEN_P")
	(net 26 "/SPKPAD_P")
	(net 27 "/SPKPAD_N")
	(net 28 "/FGEN_N")
	(net 29 "Net-(J2-Pad2)")
	(net 30 "Net-(LDO1-FB)")
	(net 31 "unconnected-(LDO1-DNC-Pad5)")
	(net 32 "Net-(C11-Pad1)")
	(net 33 "/LDO_VDD")
	(net 34 "/CLASSD_P")
	(net 35 "/CLASSD_N")
	(net 36 "Net-(POT6-Pad3)")
	(net 37 "Net-(J6-Pad3)")
	(footprint "TestPoint:TestPoint_Pad_1.0x1.0mm"
		(layer "F.Cu")
		(at 134.07898 78.7908)
		(descr "SMD rectangular pad as test Point, square 1.0mm side length")
		(tags "test point SMD pad rectangle square")
		(property "Reference" "TP29"
			(at 0 -1.448 0)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "TestPoint"
			(at 0 1.55 0)
			(layer "F.Fab")
		)
		(property "Datasheet" "~"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" "test point"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property ki_fp_filters "Pin* Test*")
		(sheetname "/")
		(sheetfile "UHMECE628_Evaluation_Board_0626.kicad_sch")
		(attr exclude_from_pos_files)
		(fp_text user "${REFERENCE}"
			(at 0 -1.45 0)
			(layer "F.Fab")
		)
		(pad "1" smd rect
			(at 0 0)
			(size 1 1)
			(layers "F.Cu" "F.Mask")
			(net 1 "GND")
			(pinfunction "1")
			(pintype "passive")
		)
		(embedded_fonts no)
	)
	(footprint ""
		(layer "F.Cu")
		(at 97.028 37.895 90)
		(property "Reference" ""
			(at 0 0 90)
			(layer "F.SilkS")
		)
		(property "Value" ""
			(at 0 0 90)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(pad "2" thru_hole circle
			(at 0 0 90)
			(size 2.3 2.3)
			(drill 1.15)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
		)
		(embedded_fonts no)
	)
	(footprint ""
		(layer "F.Cu")
		(at 85.028 34.895 90)
		(property "Reference" ""
			(at 0 0 90)
			(layer "F.SilkS")
		)
		(property "Value" ""
			(at 0 0 90)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(pad "2" thru_hole circle
			(at 0 0 90)
			(size 2.3 2.3)
			(drill 1.15)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
		)
		(embedded_fonts no)
	)
	(footprint "UH_Library:ASPI-8040S-620M-T"
		(layer "F.Cu")
		(at 122.936 72.184 90)
		(property "Reference" "L1"
			(at -2.619 -4.826 90)
			(layer "F.SilkS")
		)
		(property "Value" "62uH"
			(at 4.1844 4.9064 90)
			(layer "F.Fab")
		)
		(property "Datasheet" "~"
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" "Inductor"
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(property ki_fp_filters "Choke_* *Coil* Inductor_* L_*")
		(sheetname "/")
		(sheetfile "UHMECE628_Evaluation_Board_0626.kicad_sch")
		(attr smd)
		(pad "1" smd rect
			(at -3 0 90)
			(size 2.2 7.5)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 13 "/VOUT_P")
			(pinfunction "1")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "2" smd rect
			(at 3 0 90)
			(size 2.2 7.5)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 34 "/CLASSD_P")
			(pinfunction "2")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(embedded_fonts no)
	)
	(footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder"
		(layer "F.Cu")
		(at 132.4206 60.15)
		(descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "C13"
			(at 3.132 0 0)
			(layer "F.SilkS")
		)
		(property "Value" "100nF"
			(at 0 1.68 0)
			(layer "F.Fab")
		)
		(property "Datasheet" "~"
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property ki_fp_filters "C_*")
		(sheetname "/")
		(sheetfile "UHMECE628_Evaluation_Board_0626.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 0)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -1.0375 0)
			(size 1.175 1.45)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(roundrect_rratio 0.212766)
			(net 35 "/CLASSD_N")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 1.0375 0)
			(size 1.175 1.45)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(roundrect_rratio 0.212766)
			(net 1 "GND")
			(pintype "passive")
		)
		(embedded_fonts no)
		(model "${KICAD9_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.step"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint ""
		(layer "F.Cu")
		(at 88.028 37.895 90)
		(property "Reference" ""
			(at 0 0 90)
			(layer "F.SilkS")
		)
		(property "Value" ""
			(at 0 0 90)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(pad "2" thru_hole circle
			(at 0 0 90)
			(size 2.3 2.3)
			(drill 1.15)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
		)
		(embedded_fonts no)
	)
	(footprint "UH_Library:61300211121"
		(layer "F.Cu")
		(at 53.75 80.9)
		(property "Reference" "J13"
			(at -2.032 -2.3298 0)
			(layer "F.SilkS")
		)
		(property "Value" "6130XX11121_61300211121"
			(at -7.968 1.0378 0)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "/")
		(sheetfile "UHMECE628_Evaluation_Board_0626.kicad_sch")
		(attr through_hole)
		(pad "1" thru_hole circle
			(at -1.27 0)
			(size 1.65 1.65)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 33 "/LDO_VDD")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "2" thru_hole circle
			(at 1.27 0)
			(size 1.65 1.65)
			(drill 1.1)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 5 "/AVDD")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(embedded_fonts no)
	)
	(footprint "UH_Library:5002"
		(layer "F.Cu")
		(at 138.176 32.3834)
		(property "Reference" "TP13"
			(at 0.032 -2.2064 0)
			(layer "F.SilkS")
		)
		(property "Value" "5002"
			(at 3.2832 2.2064 0)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "PARTREV" "H"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "STANDARD" "Manufacturer Recommendations"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "SNAPEDA_PN" "5000"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "MAXIMUM_PACKAGE_HEIGHT" "4.57 mm"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "MANUFACTURER" "Keystone"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "/")
		(sheetfile "UHMECE628_Evaluation_Board_0626.kicad_sch")
		(attr through_hole)
		(pad "TP" thru_hole circle
			(at 0 0)
			(size 1.53 1.53)
			(drill 1.02)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 26 "/SPKPAD_P")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(embedded_fonts no)
		(model "${MS_RESEARCH_FOLDER}/3d models/5002.step"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz -90 -0 -0)
			)
		)
	)
	(footprint ""
		(layer "F.Cu")
		(at 82.028 40.895 90)
		(property "Reference" ""
			(at 0 0 90)
			(layer "F.SilkS")
		)
		(property "Value" ""
			(at 0 0 90)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(pad "2" thru_hole circle
			(at 0 0 90)
			(size 2.3 2.3)
			(drill 1.15)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
		)
		(embedded_fonts no)
	)
	(footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder"
		(layer "F.Cu")
		(at 61.75 52.47 -90)
		(descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
		(tags "resistor handsolder")
		(property "Reference" "Rsense1"
			(at -0.908 1.65 90)
			(layer "F.SilkS")
		)
		(property "Value" "1000"
			(at 0 1.65 90)
			(layer "F.Fab")
		)
		(property "Datasheet" "~"
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(property ki_fp_filters "R_*")
		(sheetname "/")
		(sheetfile "UHMECE628_Evaluation_Board_0626.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
		)
		(pad "1" smd roundrect
			(at -1 0 270)
			(size 1.2 1.4)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(roundrect_rratio 0.208333)
			(net 11 "/VREF2")
			(pintype "passive")
		)
		(pad "2" smd roundrect
			(at 1 0 270)
			(size 1.2 1.4)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(roundrect_rratio 0.208333)
			(net 15 "/IBIAS")
			(pintype "passive")
		)
		(embedded_fonts no)
		(model "${KICAD9_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.step"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz 0 0 0)
			)
		)
	)
	(footprint "UH_Library:5002"
		(layer "F.Cu")
		(at 138.176 49.6554)
		(property "Reference" "TP16"
			(at 0.032 -2.2064 0)
			(layer "F.SilkS")
		)
		(property "Value" "5002"
			(at 3.2832 2.2064 0)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "PARTREV" "H"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "STANDARD" "Manufacturer Recommendations"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "SNAPEDA_PN" "5000"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "MAXIMUM_PACKAGE_HEIGHT" "4.57 mm"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "MANUFACTURER" "Keystone"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "/")
		(sheetfile "UHMECE628_Evaluation_Board_0626.kicad_sch")
		(attr through_hole)
		(pad "TP" thru_hole circle
			(at 0 0)
			(size 1.53 1.53)
			(drill 1.02)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 27 "/SPKPAD_N")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(embedded_fonts no)
		(model "${MS_RESEARCH_FOLDER}/3d models/5002.step"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz -90 -0 -0)
			)
		)
	)
	(footprint "UH_Library:STX-3000"
		(layer "F.Cu")
		(at 31.242 57.658 -90)
		(property "Reference" "J6"
			(at -0.325 -13.385 90)
			(layer "F.SilkS")
		)
		(property "Value" "STX-3000"
			(at 5.39 -11.885 90)
			(layer "F.Fab")
		)
		(property "Datasheet" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "MAXIMUM_PACKAGE_HEIGHT" "5.7mm"
			(at 0 0 270)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "CREATOR" "ASHISH"
			(at 0 0 270)
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		(property "STANDARD" "Manufacturer Recommendations"
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		(property "VERIFIER" ""
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		(property "MANUFACTURER" "Kycon"
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		(sheetname "/")
		(sheetfile "UHMECE628_Evaluation_Board_0626.kicad_sch")
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		(fp_text user "PCB edge"
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		(pad "" np_thru_hole circle
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			(remove_unused_layers no)
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			(size 1.508 3.016)
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			(remove_unused_layers no)
			(net 37 "Net-(J6-Pad3)")
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		(model "${MS_RESEARCH_FOLDER}/3d models/STX-3000_rD3.IGS"
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		(descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
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		(embedded_fonts no)
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	(footprint ""
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		(descr "QFN, 32 Pin (https://www.exar.com/ds/mxl7704.pdf#page=35), generated with kicad-footprint-generator ipc_noLead_generator.py")
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		(pad "33" thru_hole circle
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		(pad "33" smd rect
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		(property ki_fp_filters "Pin* Test*")
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		(sheetfile "UHMECE628_Evaluation_Board_0626.kicad_sch")
		(attr exclude_from_pos_files)
		(fp_text user "${REFERENCE}"
			(at 0 -2.5 0)
			(layer "F.Fab")
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		(pad "1" thru_hole circle
			(at 0 0 180)
			(size 3 3)
			(drill 2)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 11 "/VREF2")
			(pinfunction "1")
			(pintype "passive")
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		(embedded_fonts no)
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	(footprint "TestPoint:TestPoint_Plated_Hole_D5.0mm"
		(layer "F.Cu")
		(at 76.8 23.5)
		(descr "Plated Hole as test Point, diameter 5.0mm")
		(tags "test point plated hole")
		(property "Reference" "TP21"
			(at 0 -3.948 0)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "TestPoint"
			(at 0 3.9 0)
			(layer "F.Fab")
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		(property "Datasheet" "~"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
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		(property "Description" ""
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property ki_fp_filters "Pin* Test*")
		(sheetname "/")
		(sheetfile "UHMECE628_Evaluation_Board_0626.kicad_sch")
		(attr exclude_from_pos_files)
		(pad "1" thru_hole circle
			(at 0 0)
			(size 6 6)
			(drill 5)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 1 "GND")
			(pinfunction "1")
			(pintype "passive")
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		(embedded_fonts no)
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	(footprint "TestPoint:TestPoint_Pad_1.0x1.0mm"
		(layer "F.Cu")
		(at 129.794 78.7908)
		(descr "SMD rectangular pad as test Point, square 1.0mm side length")
		(tags "test point SMD pad rectangle square")
		(property "Reference" "TP25"
			(at 0 -1.448 0)
			(layer "F.SilkS")
			(hide yes)
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		(property "Value" "TestPoint"
			(at 0 1.55 0)
			(layer "F.Fab")
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		(property "Datasheet" "~"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" "test point"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property ki_fp_filters "Pin* Test*")
		(sheetname "/")
		(sheetfile "UHMECE628_Evaluation_Board_0626.kicad_sch")
		(attr exclude_from_pos_files)
		(fp_text user "${REFERENCE}"
			(at 0 -1.45 0)
			(layer "F.Fab")
		)
		(pad "1" smd rect
			(at 0 0)
			(size 1 1)
			(layers "F.Cu" "F.Mask")
			(net 7 "/VOUT_N")
			(pinfunction "1")
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		(embedded_fonts no)
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	(footprint "TestPoint:TestPoint_Pad_1.0x1.0mm"
		(layer "F.Cu")
		(at 127.508 78.7908)
		(descr "SMD rectangular pad as test Point, square 1.0mm side length")
		(tags "test point SMD pad rectangle square")
		(property "Reference" "TP23"
			(at 0 -1.448 0)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "TestPoint"
			(at 0 1.55 0)
			(layer "F.Fab")
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		(property "Datasheet" "~"
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			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" "test point"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
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		(property ki_fp_filters "Pin* Test*")
		(sheetname "/")
		(sheetfile "UHMECE628_Evaluation_Board_0626.kicad_sch")
		(attr exclude_from_pos_files)
		(fp_text user "${REFERENCE}"
			(at 0 -1.45 0)
			(layer "F.Fab")
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		(pad "1" smd rect
			(at 0 0)
			(size 1 1)
			(layers "F.Cu" "F.Mask")
			(net 13 "/VOUT_P")
			(pinfunction "1")
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		(embedded_fonts no)
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	(footprint "UH_Library:SAMTEC_SMA"
		(layer "F.Cu")
		(at 108.204 23.495)
		(property "Reference" "SMA2"
			(at -0.825 -4.885 0)
			(layer "F.SilkS")
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		(property "Value" "SMA-J-P-H-ST-TH1"
			(at 10.605 4.885 0)
			(layer "F.Fab")
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		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
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		(property "Description" ""
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			(layer "F.Fab")
			(hide yes)
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		(property "MF" "Samtec"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
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		(property "DESCRIPTION" "SMA Connector Jack, Female Socket 50 Ohms Through Hole Solder"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "PACKAGE" "None"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "PRICE" "None"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
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		(property "SNAPEDA_LINK" "https://www.snapeda.com/parts/SMA-J-P-H-ST-TH1/Samtec+Inc./view-part/?ref=snap"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
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		(property "MP" "SMA-J-P-H-ST-TH1"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
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		(property "AVAILABILITY" "In Stock"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
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		(property "CHECK_PRICES" "https://www.snapeda.com/parts/SMA-J-P-H-ST-TH1/Samtec+Inc./view-part/?ref=eda"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
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		(sheetname "/")
		(sheetfile "UHMECE628_Evaluation_Board_0626.kicad_sch")
		(attr through_hole)
		(pad "1" thru_hole circle
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			(size 2.4 2.4)
			(drill 1.6)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 28 "/FGEN_N")
			(pintype "passive")
			(solder_mask_margin 0.102)
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		(pad "G1" thru_hole circle
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			(size 2.4 2.4)
			(drill 1.6)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 1 "GND")
			(pintype "power_in")
			(solder_mask_margin 0.102)
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		(pad "G2" thru_hole circle
			(at 2.54 -2.54)
			(size 2.4 2.4)
			(drill 1.6)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 1 "GND")
			(pintype "power_in")
			(solder_mask_margin 0.102)
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		(pad "G3" thru_hole circle
			(at -2.54 2.54)
			(size 2.4 2.4)
			(drill 1.6)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 1 "GND")
			(pintype "power_in")
			(solder_mask_margin 0.102)
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		(pad "G4" thru_hole circle
			(at 2.54 2.54)
			(size 2.4 2.4)
			(drill 1.6)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 1 "GND")
			(pintype "power_in")
			(solder_mask_margin 0.102)
		)
		(embedded_fonts no)
	)
	(footprint ""
		(layer "F.Cu")
		(at 97.028 34.895 90)
		(property "Reference" ""
			(at 0 0 90)
			(layer "F.SilkS")
		)
		(property "Value" ""
			(at 0 0 90)
			(layer "F.Fab")
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		(property "Datasheet" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
		)
		(pad "2" thru_hole circle
			(at 0 0 90)
			(size 2.3 2.3)
			(drill 1.15)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
		)
		(embedded_fonts no)
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	(footprint "UH_Library:RB520S30T5G"
		(layer "F.Cu")
		(at 131.8631 81.3691)
		(tags "RB520S30T5G ")
		(property "Reference" "D4"
			(at 0 -1.2941 0)
			(unlocked yes)
			(layer "F.SilkS")
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		(property "Value" "D_Schottky"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
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		(property "Datasheet" "~"
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" "Schottky diode"
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property ki_fp_filters "TO-???* *_Diode_* *SingleDiode* D_*")
		(sheetname "/")
		(sheetfile "UHMECE628_Evaluation_Board_0626.kicad_sch")
		(attr smd)
		(fp_text user "*"
			(at -1.4351 -0.307086 0)
			(layer "F.SilkS")
		)
		(fp_text user "*"
			(at -0.3937 0 0)
			(layer "F.Fab")
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		(fp_text user "${REFERENCE}"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
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		(fp_text user "*"
			(at -0.3937 0 0)
			(unlocked yes)
			(layer "F.Fab")
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		(pad "1" smd rect
			(at -0.8501 0)
			(size 0.6 0.8)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 7 "/VOUT_N")
			(pinfunction "K")
			(pintype "passive")
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		(pad "2" smd rect
			(at 0.8501 0)
			(size 0.6 0.8)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(net 1 "GND")
			(pinfunction "A")
			(pintype "passive")
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		(zone
			(net 0)
			(net_name "")
			(layer "F.Cu")
			(hatch full 0.508)
			(connect_pads
				(clearance 0)
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			(min_thickness 0.254)
			(filled_areas_thickness no)
			(keepout
				(tracks not_allowed)
				(vias not_allowed)
				(pads allowed)
				(copperpour not_allowed)
				(footprints allowed)
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			(placement
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				(sheetname "")
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			(fill
				(thermal_gap 0.508)
				(thermal_bridge_width 0.508)
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			(polygon
				(pts
					(xy 131.3678 80.9754) (xy 132.3584 80.9754) (xy 132.3584 81.7628) (xy 131.3678 81.7628)
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		(embedded_fonts no)
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	(footprint "UH_Library:5002"
		(layer "F.Cu")
		(at 78.486 94.1705 -90)
		(property "Reference" "TP4"
			(at 0.032 -2.2064 90)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "5002"
			(at 3.2832 2.2064 90)
			(layer "F.Fab")
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		(property "Datasheet" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
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		(property "Description" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
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		(property "PARTREV" "H"
			(at 0 0 270)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "STANDARD" "Manufacturer Recommendations"
			(at 0 0 270)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "SNAPEDA_PN" "5000"
			(at 0 0 270)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "MAXIMUM_PACKAGE_HEIGHT" "4.57 mm"
			(at 0 0 270)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
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		(property "MANUFACTURER" "Keystone"
			(at 0 0 270)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
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		(sheetname "/")
		(sheetfile "UHMECE628_Evaluation_Board_0626.kicad_sch")
		(attr through_hole)
		(pad "TP" thru_hole circle
			(at 0 0 270)
			(size 1.53 1.53)
			(drill 1.02)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 3 "/NONOV1")
			(pintype "passive")
			(solder_mask_margin 0.102)
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		(embedded_fonts no)
		(model "${MS_RESEARCH_FOLDER}/3d models/5002.step"
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			(rotate
				(xyz -90 -0 -0)
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	(footprint ""
		(layer "F.Cu")
		(at 91.028 40.895 90)
		(property "Reference" ""
			(at 0 0 90)
			(layer "F.SilkS")
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		(property "Value" ""
			(at 0 0 90)
			(layer "F.Fab")
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		(property "Datasheet" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
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		(property "Description" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
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		(pad "2" thru_hole circle
			(at 0 0 90)
			(size 2.3 2.3)
			(drill 1.15)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
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		(embedded_fonts no)
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	(footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder"
		(layer "F.Cu")
		(at 60.995 46.031 90)
		(descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
		(tags "capacitor handsolder")
		(property "Reference" "C4"
			(at 0 -1.68 90)
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		(property "Value" "100nF"
			(at 0 1.68 90)
			(layer "F.Fab")
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		(property "Datasheet" "~"
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		(property "Description" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
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		(property ki_fp_filters "C_*")
		(sheetname "/chip_supply/")
		(sheetfile "chip_supply.kicad_sch")
		(attr smd)
		(fp_text user "${REFERENCE}"
			(at 0 0 90)
			(layer "F.Fab")
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		(pad "1" smd roundrect
			(at -1.0375 0 90)
			(size 1.175 1.45)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(roundrect_rratio 0.212766)
			(net 2 "/chip_supply/BG Reference Tunable Load 1/vin")
			(pintype "passive")
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		(pad "2" smd roundrect
			(at 1.0375 0 90)
			(size 1.175 1.45)
			(layers "F.Cu" "F.Mask" "F.Paste")
			(roundrect_rratio 0.212766)
			(net 1 "GND")
			(pintype "passive")
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		(embedded_fonts no)
		(model "${KICAD9_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.step"
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				(xyz 0 0 0)
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			(scale
				(xyz 1 1 1)
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			(rotate
				(xyz 0 0 0)
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	(footprint ""
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		(property "Reference" ""
			(at 0 0 90)
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		(property "Value" ""
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			(layer "F.Fab")
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		(property "Datasheet" ""
			(at 0 0 90)
			(layer "F.Fab")
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		(property "Description" ""
			(at 0 0 90)
			(layer "F.Fab")
			(hide yes)
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		(pad "2" thru_hole circle
			(at 0 0 90)
			(size 2.3 2.3)
			(drill 1.15)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
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		(embedded_fonts no)
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	(footprint "TestPoint:TestPoint_Plated_Hole_D2.0mm"
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		(at 85.725 50.8)
		(descr "Plated Hole as test Point, diameter 2.0mm")
		(tags "test point plated hole")
		(property "Reference" "TP14"
			(at 0 -2.498 0)
			(layer "F.SilkS")
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		(property "Value" "TestPoint"
			(at 0 2.45 0)
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		(property "Datasheet" "~"
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			(layer "F.Fab")
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		(property ki_fp_filters "Pin* Test*")
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		(attr exclude_from_pos_files)
		(fp_text user "${REFERENCE}"
			(at 0 -2.5 0)
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		(pad "1" thru_hole circle
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			(size 3 3)
			(drill 2)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 17 "/VREF1")
			(pinfunction "1")
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		(embedded_fonts no)
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	(footprint "MountingHole:MountingHole_4mm"
		(layer "F.Cu")
		(at 138.176 100.584)
		(descr "Mounting Hole 4mm, no annular, generated by kicad-footprint-generator mountinghole.py")
		(tags "mountinghole")
		(property "Reference" "REF**"
			(at 0 -4.95 0)
			(layer "F.SilkS")
			(hide yes)
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		(property "Value" "MountingHole_4mm"
			(at 0 4.95 0)
			(layer "F.Fab")
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		(property "Datasheet" ""
			(at 0 0 0)
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		(attr exclude_from_pos_files exclude_from_bom)
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		(pad "" np_thru_hole circle
			(at 0 0)
			(size 4 4)
			(drill 4)
			(layers "*.Cu" "*.Mask")
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		(embedded_fonts no)
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	(footprint "TestPoint:TestPoint_Plated_Hole_D2.0mm"
		(layer "F.Cu")
		(at 136.4234 37.64)
		(descr "Plated Hole as test Point, diameter 2.0mm")
		(tags "test point plated hole")
		(property "Reference" "TP6"
			(at 0 -2.498 0)
			(layer "F.SilkS")
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		(property "Value" "TestPoint"
			(at 0 2.45 0)
			(layer "F.Fab")
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		(property "Datasheet" "~"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
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		(property "Description" "test point"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
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		(property ki_fp_filters "Pin* Test*")
		(sheetname "/")
		(sheetfile "UHMECE628_Evaluation_Board_0626.kicad_sch")
		(attr exclude_from_pos_files)
		(fp_text user "${REFERENCE}"
			(at 0 -2.5 0)
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		(pad "1" thru_hole circle
			(at 0 0)
			(size 3 3)
			(drill 2)
			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
			(net 26 "/SPKPAD_P")
			(pinfunction "1")
			(pintype "passive")
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		(embedded_fonts no)
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